Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Composite heat-conducting PCB (printed circuit board)

A PCB circuit board, PCB board technology, applied in the direction of circuits, semiconductor devices, printed circuit components, etc., can solve the problems of reducing the service life of the chip, unable to quickly dissipate heat, and high operating temperature of the chip, so as to improve the heat dissipation capacity and avoid chip The effect of high temperature and increased heat dissipation area

Pending Publication Date: 2022-04-01
郝芪
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to make up for the deficiencies of the existing technology and solve the problem that the PCB board cannot quickly dissipate the heat generated by the high-performance chip, so that the operating temperature of the chip is too high, the performance of the chip is damaged, and the service life of the chip is reduced. The present invention proposes a composite Thermally conductive PCB circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Composite heat-conducting PCB (printed circuit board)
  • Composite heat-conducting PCB (printed circuit board)
  • Composite heat-conducting PCB (printed circuit board)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0037] As an embodiment of the present invention, a reinforcement assembly is installed at the bottom of the PCB board 1, and the reinforcement assembly is composed of multiple groups of "mouth"-shaped reinforcement ribs, and the reinforcement ribs are distributed in concentric circles;

[0038] When working, in order to increase the heat dissipation capacity of the PCB board 1, the PCB board 1 is set as a thin plate, but as the thickness of the PCB board 1 becomes thinner, its mechanical strength will become lower, causing the PCB board 1 to easily deform, and at the same time the bottom of the PCB board 1 Groove 11 is arranged, and the central thickness of PCB board 1 is thinned, and the mechanical strength of PCB board 1 has been further reduced. The reinforced component is composed of concentrically distributed reinforcing ribs. When the PCB board 1 is subjected to the force in the left and right directions, the left and right parts of the reinforced component will generate...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of PCBs, and particularly relates to a composite heat conduction PCB which comprises a PCB, a heat dissipation plate, a clamping ring and fins, the heat dissipation plate is installed on the lower end face of the PCB, heat on the PCB is absorbed, the PCB absorbs heat generated by a chip more quickly, the fins are evenly installed on the lower end face of the heat dissipation plate, the heat dissipation area of the heat dissipation plate is increased, and the heat dissipation efficiency of the PCB is improved. A reinforcing tube is arranged in the PCB, and the internal structure of the reinforcing tube is a Tesla valve, so that the heat of the part generating more heat on the PCB is quickly dissipated from the part generating less heat, the working temperatures of chips on all parts of the PCB are appropriate and similar, and the phenomenon that the heat dissipation capacity of the PCB is increased due to the fact that the temperature of the chips is too high is avoided. And the performance and the service life of the chip are damaged.

Description

technical field [0001] The invention belongs to the technical field of PCB circuit boards, in particular to a composite heat-conducting PCB circuit board. Background technique [0002] The Chinese name of PCB board is printed circuit board, also known as printed circuit board, which is an important electronic component. PCB board can replace complex wiring and realize the electrical connection between components in the circuit, which not only simplifies the assembly and welding of electronic products Work, reduce the workload of wiring in the traditional way, greatly reduce the labor intensity of workers; and reduce the volume of the whole machine, reduce product costs, improve the quality and reliability of electronic equipment. [0003] The chip carried on the PCB board generates heat when it is working, and the PCB needs to dissipate heat from the chip. There are two traditional ways to dissipate heat from the PCB board: the first way is to cool the PCB board through the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H01L23/367
Inventor 郝芪吴大胜
Owner 郝芪
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products