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Improved electric contact structure, and relay and switch using same

An electrical connector, relay technology, applied in electromagnetic relays, electromagnetic relay details, relays, etc., can solve the problems of Ni segregation, difficult to obtain contact resistance, difficult and so on

Inactive Publication Date: 2004-03-17
宜尔敏电子设备株式会社
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is difficult to obtain high anti-adhesion and high stable contact resistance at the same time with the above-mentioned conventional technologies.
[0008] In addition, if the alloy of the contact surface layer contains Ni, it will cause the problem of Ni segregation, so it is difficult to obtain a stable contact resistance.

Method used

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  • Improved electric contact structure, and relay and switch using same
  • Improved electric contact structure, and relay and switch using same
  • Improved electric contact structure, and relay and switch using same

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0049] In this example, the moveable break joint has a moveable break contact surface layer consisting of Au 82 Ag 15 PD 3 alloy, while the fixed break joint has a fixed break contact surface layer, which also has Au 82 Ag 15 PD 3 alloy. Au 82 Ag 15 PD 3 The composition ratio of the alloy was 82% by weight of Au, 15% by weight of Ag, and 3% by weight of Pd.

example 2

[0051] In this example, the moveable break joint has a moveable break contact surface layer consisting of Au 76 Ag 15 PD 9 alloy, while the fixed break joint has a fixed break contact surface layer, which also has Au 76 Ag 15 PD 9 alloy. Au 76 Ag 15 PD 9 The composition ratio of the alloy was 76% by weight of Au, 15% by weight of Ag, and 9% by weight of Pd.

example 3

[0053] In this example, the moveable break joint has a moveable break contact surface layer consisting of Au 86 Ag 8 PD 6 alloy, while the fixed break joint has a fixed break contact surface layer, which also has Au 86 Ag 8 PD 6 alloy. Au 86 Ag 8 PD 6 The composition ratio of the alloy was 86% by weight of Au, 8% by weight of Ag, and 6% by weight of Pd.

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Abstract

The present invention provides an electric contact structure comprising a first contact surface and a second contact surface, wherein at least one of the first and second contact surfaces comprises an AuAgPd alloy including 7 to 16% by weight of Ag and 1 to 10% by weight of Pd, whereby a high anti-adhesion property and a highly stable contact resistance can be obtained particularly when the electric contacts are in non-operating state.

Description

technical field [0001] The present invention relates to an improved electric joint structure and a relay and a switch using the joint, in particular, to a small-sized relay and a small-sized switch for a communication device operating at a relatively small current. Background technique [0002] In recent years, there has been an increasing need to reduce the size and power consumption of electronic or electrical devices. Under such circumstances, there is a simultaneous need to reduce the size and increase the sensitivity of relays and switches used in communication devices provided on printed circuit boards. A relay or switch of small size requires a small contact force or a small contact pressure. Of particular importance is the need to maintain the stability of the original contact resistance. In order to maintain the stability of the original contact resistance, it is better to make the contact surface layer with soft metal. [0003] The relays and switches are arrang...

Claims

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Application Information

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IPC IPC(8): H01H50/54H01H1/021H01H1/023H01H1/04
CPCH01H1/021H01H1/023H01H1/04Y10T428/31678
Inventor 小野寺时一池田末治郎
Owner 宜尔敏电子设备株式会社
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