Wafer laser coding method and wafer laser coding system

Abstract

The invention discloses a wafer laser tagging method and a wafer laser tagging system. The wafer laser tagging method comprises the following steps: enabling a to-be-tagged surface of a wafer to face the transmission direction of a laser beam; establishing a tagging document through tagging software, and setting tagging contents in the tagging document; importing the tagging document into image processing software, and determining a tagging position; laser tagging processing is conducted on the tagging position through a laser beam; the processing process is free of consumables and pollution, the cost is lower, and the anti-counterfeiting property is better; a hyperfine mark is formed on the surface or inside the wafer under the action of a high-energy-density laser beam; non-contact machining is adopted, mechanical stress is avoided, and the product quality can be effectively improved; and positioning and code assigning can be achieved through machine vision, the alignment precision is high, the clamp can be placed at any angle within the machining plane range, the code assigning position consistency is good, and the production efficiency is greatly improved.

Description

technical field [0001] The present application relates to the technical field of laser coding, in particular to a wafer laser coding method and a wafer laser coding system. Background technique [0002] Wafers, for example, may be silicon wafers used to fabricate silicon semiconductor circuits, the starting material of which is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. The silicon ingot is ground, polished, and sliced ​​to form a silicon wafer, that is, a wafer. [0003] Wafers generally have the characteristics of high hardness, high brittleness, and poor thermal conductivity. The wafer marking step is an indispensable step in the semiconductor manufacturing process, and its purpose is mainly to mark the ID (Identity) of the wafer, so as to facilitate the tracking of the wafer in the subsequent manufacturing, testing and packaging processes of the w...

AI Technical Summary

Problems solved by technology

[0005] This application proposes a wafer laser coding method and a wafer laser coding system, aiming to solve the problems of poor precision, high cost, non-environmental protection, easy alteration, poor anti-counterfeiting, And the problems of poor coding effect and difficult code recognition make it improve accuracy, reduce cost, good environmental protection, code coding is not easy to fall off and alter, good anti-counterfeiting performance, good coding effect and easy identification

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