An etching device for the manufacture of integrated optoelectronic devices

A technology of optoelectronic devices and etching devices, which is applied in semiconductor/solid-state device manufacturing, electrical components, final product manufacturing, etc., and can solve problems that affect the etching effect of integrated optoelectronic devices, uneven etching of integrated optoelectronic devices, and failure to meet user needs. , to achieve the effects of improving the etching effect, improving the practical performance, and improving the use effect

Active Publication Date: 2022-05-31
GUILIN TRYIN TECH CO LTD
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AI Technical Summary

Problems solved by technology

[0003] Nowadays, with the rapid development of electronic technology, integrated optoelectronic devices are made more and more finely. In the production process of integrated optoelectronic devices, the etching process is particularly important, and the existing etching devices are used to etch electronic devices. In the process, there will be the following problems. One: the traditional etching technology is mainly carried out manually, but this method cannot ensure that the etchant on the surface of the integrated optoelectronic device is uniformly applied, resulting in uneven etching of the integrated optoelectronic device. Less than the ideal effect; second: when the etching solution is applied to the surface of the integrated optoelectronic device, the etching equipment is prone to shake, which in turn affects the etching effect of the integrated optoelectronic device; therefore, there are deficiencies and cannot meet the needs of users. Therefore, There is a need for further improvement

Method used

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  • An etching device for the manufacture of integrated optoelectronic devices
  • An etching device for the manufacture of integrated optoelectronic devices
  • An etching device for the manufacture of integrated optoelectronic devices

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Embodiment Construction

[0033] Further, the opposite side of the movable slider 71 and the movable member 62 is provided with a tangential slope, and the movable slider 71 and

[0034] Further, the calibration assembly 8 includes a mounting block 81, a calibration main rod 82, a calibration piece 83 and a return spring 84; the mounting block

[0035] Further, the correcting member 83 is used in conjunction with the drive shaft 3.

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Abstract

The invention provides an etching device for manufacturing integrated optoelectronic devices, which includes a main body, a driving mechanism is arranged inside the main body, a driving shaft is arranged on the driving mechanism, an etching device is arranged on the driving shaft, and an etching device is arranged on the driving shaft. A fixed part is arranged on the inner wall, and the fixed part is provided with an offset induction assembly, a linkage assembly and a correction assembly; the offset induction assembly includes an induction air cushion, a movable part, an induction main rod and a guide. The etching device for the manufacture of integrated optoelectronic devices is provided with a correction component. Once the etching device shakes, the etching device will inevitably drive the drive shaft to vibrate synchronously. The offset drive shaft is corrected, so as to fundamentally solve the problem of the shaking of the etching device, thereby improving the etching effect of the etching device on the integrated optoelectronic device, and effectively improving the reliability of the device.

Description

An etching device for manufacturing integrated optoelectronic devices technical field The invention belongs to the technical field of electronic device manufacturing, and in particular relates to a kind of etching device for the manufacture of integrated optoelectronic devices set. Background technique The basic process of integrated optoelectronic device production generally includes developing process, etching process and stripping process, and developing process. The process refers to the use of a developer to dissolve the part of the film that has not been irradiated by ultraviolet rays, and has undergone a polymerization reaction after ultraviolet radiation. The part of the integrated optoelectronic device is retained; the etching process refers to the use of etching solution to etch the copper exposed on the integrated optoelectronic device that is not protected by the protective film Carved off; the film stripping process refers to removing the protective film...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/306C23F1/02C23F1/08
CPCH01L21/67075H01L21/67259H01L21/30604C23F1/08C23F1/02Y02P70/50
Inventor 王垚磊张见超王建国
Owner GUILIN TRYIN TECH CO LTD
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