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Hot-melt pressure-sensitive adhesive for RFID electronic tag and preparation method of hot-melt pressure-sensitive adhesive

A hot-melt pressure-sensitive adhesive and electronic label technology, used in pressure-sensitive films/sheets, adhesives, heat-activated films/sheets, etc. , strong adhesion, excellent high and low temperature resistance

Pending Publication Date: 2022-03-11
佛山市南海骏驰新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to meet the increasingly wide demand for electronic labels, hot-melt pressure-sensitive adhesive electronic labels have emerged as the times require. It is necessary to develop a hot-melt pressure-sensitive adhesive with good initial adhesion, good long-lasting adhesion, excellent high and low temperature resistance, and suitable for high-speed coating production

Method used

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  • Hot-melt pressure-sensitive adhesive for RFID electronic tag and preparation method of hot-melt pressure-sensitive adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A hot-melt pressure-sensitive adhesive for RFID electronic tags, comprising the following raw materials in parts by weight: 45 parts of styrene-isoprene-styrene block copolymer, 35 parts of tackifying resin, 35 parts of softener, and 0.5 parts of antioxidant Part; the styrene-isoprene-styrene block copolymer is the styrene-isoprene-styrene block copolymer of specification A and specification B in a weight ratio of 7:1, the The styrene-isoprene-styrene block copolymer of specification A has a SI content of 50% and the styrene content of 16%; the styrene-isoprene-styrene block copolymer of specification B The SI content is 30%, and the styrene content is 19%.

[0029] The tackifying resin is a mixture of rosin resin and hydrogenated petroleum resin in a weight ratio of 5:9.

[0030] The softening point of the rosin resin is 90°C, and the softening point of the hydrogenated petroleum resin is ≥97°C.

[0031] The softener is a mixture of naphthenic oil and liquid polyisob...

Embodiment 2

[0040]A hot-melt pressure-sensitive adhesive for RFID electronic tags, comprising the following raw materials in parts by weight: 30 parts of styrene-isoprene-styrene block copolymer, 70 parts of tackifying resin, 20 parts of softener, and 2 parts of antioxidant part; the styrene-isoprene-styrene block copolymer is the styrene-isoprene-styrene block copolymer of specification C and specification D in a weight ratio of 5:3, and the The styrene-isoprene-styrene block copolymer of specification C has a SI content of 60% and the styrene content of 15%; the styrene-isoprene-styrene block copolymer of specification D The SI content is 0%, and the styrene content is 29%.

[0041] The tackifying resin is a mixture of rosin resin and hydrogenated petroleum resin in a weight ratio of 2:5.

[0042] The softening point of the rosin resin is 110°C, and the softening point of the hydrogenated petroleum resin is ≥97°C.

[0043] The softener is a mixture of naphthenic oil and liquid polyiso...

Embodiment 3

[0052] A hot-melt pressure-sensitive adhesive for RFID electronic tags, comprising the following raw materials in parts by weight: 40 parts of styrene-isoprene-styrene block copolymer, 55 parts of tackifying resin, 30 parts of softener, and 1 part of antioxidant part; the styrene-isoprene-styrene block copolymer is the styrene-isoprene-styrene block copolymer of specification A and specification B in a weight ratio of 6:2, the The styrene-isoprene-styrene block copolymer of specification A has a SI content of 50% and the styrene content of 16%; the styrene-isoprene-styrene block copolymer of specification B The SI content is 30%, and the styrene content is 19%.

[0053] The tackifying resin is a mixture of rosin resin and hydrogenated petroleum resin in a weight ratio of 3:7.

[0054] The softening point of the rosin resin is 100°C, and the softening point of the hydrogenated petroleum resin is ≥97°C.

[0055] The softener is a mixture of naphthenic oil and liquid polyisobut...

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Abstract

The invention discloses a hot-melt pressure-sensitive adhesive for an RFID (Radio Frequency Identification Device) electronic tag, which is prepared from the following raw materials in parts by weight: 30 to 45 parts of styrene-isoprene-styrene block copolymer, 35 to 70 parts of tackifying resin, 20 to 35 parts of softening agent and 0.5 to 2 parts of antioxidant. The styrene-isoprene-styrene block copolymers comprise at least two of a specification A, a specification B, a specification C and a specification D, and the weight ratio of any two specifications in the styrene-isoprene-styrene block copolymers is (5-7): (1-3). The hot-melt pressure-sensitive adhesive for the RFID electronic tag has the advantages of good initial adhesion, strong bonding force, good adhesion to a base material, good die cutting and excellent high and low temperature resistance, and is suitable for a high-speed coating machine of 100m / min.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a hot-melt pressure-sensitive adhesive for RFID electronic tags and a preparation method thereof. Background technique [0002] RFID (Radio Frequency Identification) technology, also known as radio frequency identification, is a communication technology, commonly known as electronic tags. Specific targets can be identified by radio signals and related data can be read and written without the need for mechanical or optical contact between the identification system and specific targets. With the rapid development of the Internet of Things, along with the urgent need for intelligence, informatization, and high efficiency, RFID-containing electronic tags are becoming more and more popular in all walks of life. [0003] In order to meet the increasingly wide demand for electronic labels, hot-melt pressure-sensitive adhesive electronic labels have emerged as the times require. It i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J153/02C09J157/02C09J193/04C09J11/08C09J7/35C09J7/38
CPCC09J153/02C09J157/02C09J11/08C09J7/35C09J7/387C09J2301/302C09J2301/304C09J2203/334C08L53/02C08L93/04C08L57/02
Inventor 陈林
Owner 佛山市南海骏驰新材料有限公司
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