Processing technology of rigid-flex board for high-frequency signal transmission

A technology of flexible and rigid boards and high-frequency signals, which is applied in the manufacture of multi-layer circuits, electrical components, and printed circuits. Solve the shrinkage and the effect of glue flow on the soft board

Pending Publication Date: 2022-03-01
广德今腾电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Most of the 5G products use ultra-low loss materials, but the materials used in the current rigid-flex boards are all conventional FR4 materials, and the focus is on the adhesive sheets used between layers. The need for high-frequency signal transmission
Therefore, if it is necessary to make a soft-rigid combination board for high-frequency signal transmission, the rigid board core board can use ultra-low loss boards, but due to the large dielectric loss of the interlayer bonding sheet, it cannot meet the needs of this type of product

Method used

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Examples

Experimental program
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Embodiment

[0028] An embodiment, a rigid-flex board processing technology for high-frequency signal transmission, comprising the following steps:

[0029] Step 1, roughen and clean the copper surface of the corresponding R-F soft board;

[0030] Step 2, according to the requirements, the R-F soft board is aligned with the cover film, pressed and cured;

[0031] Step 3, do laser molding on the cured soft board, and mill out the shape of the soft board;

[0032] Step 4, attach PI tape to the formed soft board;

[0033] Step 5: Combine the inner core boards of all layers and the formed adhesive sheets according to the lamination diagram;

[0034] Step 6, press the combined boards according to the parameters;

[0035] Step 7, the laminated board is produced according to the process until the cover is opened and formed;

[0036] Step 8, tear off the PI tape pasted on the soft board.

[0037] In step 1, the roughening and cleaning treatment of the copper surface adopts treatment methods i...

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PUM

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Abstract

The invention belongs to the technical field of rigid-flex board processing, and particularly relates to a rigid-flex board processing technology for high-frequency signal transmission. According to the invention, through a special glue blocking mode, the problem of glue flowing of a flexible board during lamination of conventional flowing prepregs can be effectively solved, and the problem of internal shrinkage of non-flowing prepregs and semi-flowing prepregs can also be solved.

Description

technical field [0001] The invention belongs to the technical field of rigid-flex board processing, in particular to a rigid-flex board processing technology for high-frequency signal transmission. Background technique [0002] Rigid-flex board refers to a special circuit board made by pressing a rigid circuit board (PCB) and a flexible circuit board (FPC). The materials used to make the board are mainly rigid board and flexible board material polyimide (PI). The rigid-flex board combines the rigidity of the rigid circuit board and the bendability of the flexible board, making the PCB no longer a two-dimensional plane layer, but a three-dimensional internal connection and arbitrary bending and folding. It can replace composite circuit boards connected by multiple connectors, multiple cables and ribbon cables. [0003] With the commercialization of 5G, the frequency of PCB signal transmission signal has increased to above 10GHZ. In order to support 5G products, the future u...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/4635H05K3/4691
Inventor 刘鹍李伟熊俊杰王举曹号
Owner 广德今腾电子科技有限公司
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