Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Electronic action ultrahigh vacuum evaporation source

An ultra-high vacuum, electronic action technology, applied in vacuum evaporation plating, ion implantation plating, metal material coating process and other directions, can solve the problems of uncontrollable evaporation rate, poor evaporation effect, etc. The effect of plating effect and film uniformity is good

Pending Publication Date: 2022-02-11
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide an electron action ultra-high vacuum evaporation source, aiming to solve the problem that the evaporation effect of the ultra-high vacuum evaporation source cannot be controlled when the evaporation rate is not good.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic action ultrahigh vacuum evaporation source
  • Electronic action ultrahigh vacuum evaporation source

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] It should be noted that, the present invention uses the electron action ultra-high vacuum evaporation source as an example to introduce the specific structure and working principle of the present invention. The electron action ultra-high vacuum evaporation source disclosed in this application can evaporate tungsten, molybdenum, tantalum, ni...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an electronic action ultrahigh vacuum evaporation source which comprises a base, an evaporation assembly, a water-cooling protective sleeve and a temperature control assembly, wherein the evaporation assembly is arranged on the base, the water cooling protective sleeve is arranged on the base and is arranged outside the evaporation assembly in a sleeving manner. The water-cooling protective sleeve and the base form an evaporation inner cavity; and the temperature control assembly is arranged on the base, is electrically connected with the evaporation assembly and the water cooling protective sleeve at the same time, and is used for monitoring and controlling the temperature in the evaporation inner cavity in real time. According to the electronic action ultrahigh vacuum evaporation source, the temperature control assembly is arranged on the base to adjust the temperature in the evaporation process, so that the evaporation rate is controlled, and the evaporation effect is improved.

Description

technical field [0001] The invention relates to the technical field of ultra-high vacuum evaporation, in particular to an electron action ultra-high vacuum evaporation source. Background technique [0002] At present, in the field of material science, vacuum coating technology is a new material synthesis and processing technology. With the rapid development of global manufacturing and information technology, the application of vacuum coating technology is becoming more and more extensive. Vacuum coating technology and its equipment It has a broad application market and development prospects. Vacuum coating adopts the evaporation method. The principle is to place the evaporated material in the crucible of the vacuum evaporation source device. By heating the crucible, the material is transformed from solid to gaseous atoms, atomic groups or molecules, and then condensed into the to-be-treated A thin film is formed on the surface of the coated substrate. [0003] However, in ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/30C23C14/54
CPCC23C14/30C23C14/543
Inventor 赵维巍吴向方
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com