Adhesive for bonding cables and preparation method of adhesive
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An adhesive and bonding technology, applied in the direction of adhesives, adhesive types, adhesive additives, etc., can solve the problems of weak heat resistance and poor water resistance.
Pending Publication Date: 2022-02-01
黄梦飞
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Problems solved by technology
[0003] Adhesives used between cables often have disadvantages such as weak heat resistance and poor water resistance. Adhesive for inter-bonding
Method used
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Embodiment 1
[0029] An adhesive used for bonding cables, mainly comprising:
[0030] 15 parts of modified aldehyde and ketone resin, 10 parts of polyurethane, 4 parts of sodium alginate, 1.5 parts of phenolic lignin, 1 part of filler, and 1 part of curing agent.
[0031] A preparation method of an adhesive for bonding between cables, the preparation method of the adhesive for bonding between cables is:
[0032] (1) Mix formaldehyde and cyclohexanone in a three-necked flask at a mass ratio of 1:3.7, heat it in a water bath to 80°C, and add 0.15 times the mass fraction of formaldehyde with 10% sodium hydroxide solution dropwise at 5 drops / min , after reacting for 1 hour, cool to room temperature, add isopropanone with 0.3 times the mass of formaldehyde and deionized water with 0.2 times the mass of formaldehyde, stir at 800rpm and heat up to 80°C, add sodium alkylbenzenesulfonate with 0.1 times the mass of formaldehyde, wait After there is no solid in the three-necked flask, add a mixture o...
Embodiment 2
[0040] An adhesive used for bonding cables, mainly comprising:
[0041] 40 parts of modified aldehyde and ketone resin, 20 parts of polyurethane, 10 parts of sodium alginate, 4 parts of phenolic lignin, 4 parts of filler, and 4 parts of curing agent.
[0042] A preparation method of an adhesive for bonding between cables, the preparation method of the adhesive for bonding between cables is:
[0043] (1) Mix formaldehyde and cyclohexanone at a mass ratio of 1:4 and place them in a three-necked flask, heat them in a water bath to 86°C, and add 0.15 times the mass fraction of formaldehyde with 10% sodium hydroxide solution dropwise at 8 drops / min After reacting for 1.5 hours, cool to room temperature, add isopropanone with 0.3 times the mass of formaldehyde and deionized water with 0.2 times the mass of formaldehyde, stir at 1200rpm and heat up to 84°C, add sodium alkylbenzenesulfonate with 0.1 times the mass of formaldehyde, After there is no solid in the three-necked flask, ad...
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Abstract
The invention discloses an adhesive for bonding cables and a preparation method of the adhesive, and relates to the technical field of adhesives. According to the prepared adhesive for bonding the cables, modified aldehyde ketone resin, polyurethane, sodium alginate and lignin are used as raw materials; the modified aldehyde ketone resin is prepared by adding melamine and formaldehyde in the aldehyde ketone resin preparation process; carboxyl and hydroxyl on sodium alginate are firstly utilized to be crosslinked with polyurethane, meanwhile, modified aldehyde ketone resin is introduced, and finally phenolated lignin is added to form the adhesive with lignin branched chains, so that the water resistance of the adhesive is further enhanced, and the service life of the adhesive in a humid environment is prolonged; and the lignin of the net structure and the cross-linked network are further cross-linked to form a three-dimensional network structure, so that the adhesion is enhanced to the maximum extent. The adhesive for bonding the cables, prepared by the application, has excellent heat resistance and water resistance and is high in bonding strength.
Description
technical field [0001] The invention relates to the technical field of adhesives, in particular to an adhesive used for bonding cables and a preparation method thereof. Background technique [0002] With the development of society, adhesives have penetrated into all walks of life and played an important role in various fields. As adhesives are used more and more in various fields, the requirements for adhesives are also getting higher and higher. The emergence of bonding technology can meet the development needs of the electronic market. Compared with traditional connection methods, bonding technology has the characteristics of wide bonding range, no damage to the bonded materials, effective weight reduction, and improved production efficiency. Has unique properties. [0003] Adhesives used between cables often have disadvantages such as weak heat resistance and poor water resistance. Adhesives for bonding. Contents of the invention [0004] The object of the present i...
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Application Information
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