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Assembling equipment for automatic splitting and assembling of ceramic PCB

A technology for automatic board separation and assembly equipment, which is applied in the direction of assembling printed circuits with electrical components, electrical components, and printed circuit manufacturing. effect of effect

Active Publication Date: 2021-12-24
深圳市兴泰达科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the existing ceramic PCB board is assembled, the assembly process is relatively simple, the assembled PCB board has poor installation strength, and the installation efficiency is low. Based on this, further improvement is needed

Method used

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  • Assembling equipment for automatic splitting and assembling of ceramic PCB
  • Assembling equipment for automatic splitting and assembling of ceramic PCB
  • Assembling equipment for automatic splitting and assembling of ceramic PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] see Figure 1-7 In the present invention, the assembly equipment for ceramic PCB automatic sub-board assembly includes an assembly base 1, and the top of the assembly base 1 is symmetrically provided with supporting vertical columns 2, and the tops of the two supporting vertical columns 2 are jointly equipped with a supporting top plate 3, and the assembly The base 1 is provided with a drive assembly 4, and the installation cavity 5 of the assembled base 1 is provided with an installation shaft 6, and the installation shaft 6 is provided with a positive installation screw area 7 and a reverse installation screw area 8; the positive installation screw area 7, the reverse installation The threads of the screw zone 8 are opposite;

[0032] The positive installation screw area 7 and the reverse installation screw area 8 are threaded with a threaded moving block 9, and the threaded moving block 9 is provided with a passage post 10, and the passage post 10 passes through the ...

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Abstract

The invention discloses assembling equipment for automatic splitting and assembling of a ceramic PCB. The equipment comprises an assembling pedestal, wherein the top of the assembling pedestal is symmetrically provided with supporting vertical columns, and the top ends of the two supporting vertical columns are jointly provided with a supporting top plate. According to the invention, a driving motor is started, a driving rotating shaft rotates, a power bevel gear rotates, the power bevel gear is meshed with a driven bevel gear, the driven bevel gear rotates, a worm drives a turbine to rotate, then rotation of the mounting rotating shaft is achieved, rotation of a forward mounting screw area and a reverse mounting screw area is achieved, and opposite movement of threaded moving blocks is achieved, so that a pushing assembly drives a first ceramic PCB and a second ceramic PCB to move, and then an assembling clamping block is clamped with an assembling opening in the second ceramic PCB in a matched mode; and the threaded area rotates to drive a trapezoidal seat to move, so that a sliding wheel slides in a sliding groove, the vertical columns are triggered to move upwards, a movable contact piece is driven to make contact with a static contact piece, an alarm device gives an alarm, and a controller is driven and controlled.

Description

technical field [0001] The invention relates to the technical field of ceramic PCBs, in particular to an assembly device for automatic sub-board assembly of ceramic PCBs. Background technique [0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of an alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate (single or double-sided) at high temperature. The produced ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current-carrying capacity. ability. Therefore, the ceramic substrate has become the basic material of high-power power electronic circuit structure technology and interconnection technology; it has high enough mechanical strength, and can be used as a supporting component in addition to carrying components; it has good processabil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/36
CPCH05K3/368
Inventor 李东方
Owner 深圳市兴泰达科技有限公司
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