Conductive adhesive, solid conductive adhesive film and preparation method and application thereof

Abstract

The invention provides a conductive adhesive, a solid conductive adhesive film and a preparation method and application thereof. The conductive adhesive is prepared from the following raw materials in specific parts: thermoplastic resin, thermosetting resin, conductive filler, a conductive accelerant and a curing agent. According to the conductive adhesive, thermoplastic resin is matched with thermosetting resin to serve as a matrix, and specific parts of conductive filler and conductive accelerant are added, so that the conductive adhesive has excellent conductive performance under the condition that the addition amount of the conductive filler is relatively low, and further the conductive adhesive has excellent mechanical performance; and the solid conductive adhesive film prepared from the conductive adhesive also has relatively high bonding strength and aging resistance, and can be applied to connection of devices in a module.

Description

technical field [0001] The invention belongs to the technical field of conductive materials, and in particular relates to a conductive adhesive, a solid conductive adhesive film and a preparation method and application thereof. Background technique [0002] High-pixel camera modules are easily disturbed by external signals, so the light-receiving components need to increase the shielding requirements. connection for a stable electrical connection. [0003] The reinforcing plate is generally stainless steel plate, and the FPC plate is composed of polyimide film and gold fingers. It is required that the conductive adhesive film used for connection can be applied to the bonding of various materials, and it must achieve relatively high bonding performance while achieving bonding performance. High-performance conductivity and high stability, because the camera module needs to be operated at high temperature later, so after the adhesive is bonded, a lead-free reflow soldering tes...

AI Technical Summary

Problems solved by technology

[0005] However, the filling amount of the conductive filler in the conductive adhesive or conductive adhesive film provided in the prior art is relatively high, which will affect the mechanical properties of the conductive adhesive film, and will also make the cost of the conductive adhesive too high, which is not conducive to mass production. industrial production

Images