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A control method and pcb board for improving the warping of aluminum-based mixed-press structure laminated board

A control method and PCB board technology, applied in laminated printed circuit boards, multi-layer circuit manufacturing, printed circuit manufacturing, etc., can solve problems such as excessive board warping, inconsistent expansion and contraction changes, and affecting product flatness.

Active Publication Date: 2022-05-03
HUIZHOU KING BROTHER CIRCUIT TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, automotive power module products are mainly based on thick copper core board laminated aluminum base structure, relying on surface copper, hole copper, high thermal conductivity bonding sheet and metal aluminum base to achieve rapid heat conduction of the product, because the metal aluminum base and copper core board are Two materials with different physical properties, when pressed at high temperature, their expansion and contraction changes are inconsistent, and board warpage is easily exceeded (warping degree ≥ 1.5%), which affects product flatness and has a potential impact on customer follow-up placement quality

Method used

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  • A control method and pcb board for improving the warping of aluminum-based mixed-press structure laminated board
  • A control method and pcb board for improving the warping of aluminum-based mixed-press structure laminated board
  • A control method and pcb board for improving the warping of aluminum-based mixed-press structure laminated board

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Experimental program
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Effect test

Embodiment 1

[0098] Embodiment 1: A control method for improving the warping of aluminum-based mixed-compression structure laminates, including

[0099] S1. Laminate structure optimization, select the aluminum base 100 and the inner core plate 200 with preset thickness and hardness, so that the thickness ratio of the aluminum base 100 and the core plate dielectric layer 210 in the inner core plate 200 is 10:1;

[0100] S2. Fabrication of inner core board;

[0101] S3. Production of aluminum-based components. After the aluminum-based 100 is cut, the aluminum-based 100 is pre-hot-pressed once by a conventional hot-pressing method; the parameters of the conventional hot-pressing method are: the furnace temperature is 140°C, and the heating rate is 1.8°C-2.2 ℃ / min, pressure 30 kg -40kg / cm2, 200 ℃ heat preservation and pressing ≥ 60min.

[0102] S4, pressing, pressing the inner core board 200 and the aluminum base 100 together with a vacuum laminator;

[0103] S5, plate warping leveling treat...

Embodiment 2

[0116] Embodiment 2: A control method for improving the warping of aluminum-based mixed-compression structure laminates, including

[0117] S1. Laminate structure optimization, select the aluminum base 100 and the inner layer core board 200 with preset thickness and hardness, so that the thickness ratio of the aluminum base 100 and the core board dielectric layer 210 in the inner layer core board 200 is 15:1;

[0118] S2. Fabrication of inner core board;

[0119] S3. Production of aluminum-based components. After the aluminum-based 100 is cut, the aluminum-based 100 is pre-hot-pressed once by the rapid hot-pressing method; the parameters of the rapid hot-pressing method are: the furnace temperature is 160°C-200°C, and the heating rate is 5 ℃-10℃ / min, pressure 30kg-40kg / cm2, heat preservation and pressing at 200℃ for 20min.

[0120] S4, pressing, pressing the inner core board 200 and the aluminum base 100 together with a vacuum laminator;

[0121] S5, plate warping leveling t...

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Abstract

The invention discloses a control method for improving the warping of aluminum-based mixed-press structure laminated boards, which includes optimizing the laminated structure so that the thickness ratio of the aluminum base and the core board medium layer in the inner-layer core board is ≥10:1; the inner-layer core Production of boards; production of aluminum base parts, after the aluminum base is cut, the aluminum base is pre-heated once; pressing, the inner core board and the aluminum base are pressed together by a vacuum laminator; the board is warped and leveled, After pressing, use a warping leveler for leveling treatment; X-Ray target shooting; ceramic grinding; outer circuit production; acid etching; solder mask; characters; immersion gold; E-T testing; CNC shape; finished product inspection; Selecting the aluminum base and the inner core board with a preset thickness can make the whole PCB board thinner and thinner, reduce board warpage and meet the high pressure resistance requirements of the PCB board, and heat press once with a high-temperature press (200°C) in advance to improve the aluminum The thermal stability of the base can reduce the expansion and contraction of the aluminum base during hot compression, and meet the high flatness requirements of customers.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a control method and a PCB board for improving the warpage of aluminum-based mixed-press structure laminated boards. Background technique [0002] At present, automotive power module products are mainly based on thick copper core board laminated aluminum base structure, relying on surface copper, hole copper, high thermal conductivity bonding sheet and metal aluminum base to achieve rapid heat conduction of the product, because the metal aluminum base and copper core board are When two materials with different physical properties are pressed together at high temperature, their expansion and contraction changes are inconsistent, and board warpage is easily exceeded (warping degree ≥ 1.5%), which affects the flatness of the product and has a potential impact on the quality of the customer's subsequent placement. Contents of the invention [0003] Based on this, it is necessary...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/46
CPCH05K3/0058H05K3/4638
Inventor 唐宏华徐得刚李纪生王斌樊廷慧刘敏
Owner HUIZHOU KING BROTHER CIRCUIT TECH
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