Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Intelligent patent application method and system based on DIKW

A patented and intelligent technology, applied in the field of patent intelligent application method and system based on DIKW, can solve the problems of low efficiency of manual review, error-prone, prolonged patent application cycle, etc., to reduce the number of unsuccessful submissions, improve quality, The effect of reducing the number of communications

Pending Publication Date: 2021-10-22
HAINAN UNIVERSITY
View PDF13 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this context, industries with innovation as the original driving force need to be continuously upgraded with the development of artificial intelligence to meet people's needs. Traditional patent application, review, reply, authorization and other links need manual review. subjectivity, prone to errors, and the efficiency of manual review is low, which can easily lead to the problem of prolonging the patent application cycle. In view of the above problems, this application proposes a DIKW-based intelligent application method and system for invention patents, aiming to optimize Quality of the patent application process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Intelligent patent application method and system based on DIKW
  • Intelligent patent application method and system based on DIKW
  • Intelligent patent application method and system based on DIKW

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] The principles and features of the present invention will be described below in conjunction with the accompanying drawings, and the enumerated embodiments are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0037] refer to figure 1 , the present invention provides a DIKW-based patent intelligent application method, the method comprising the following steps:

[0038] S1: In the patent acceptance stage, the patent applicant uploads the application documents to the form set by the system, and the system fills the application documents into the form through an intelligent filling algorithm;

[0039] S2: In the preliminary patent examination stage, the system judges, identifies or predicts the patent content that obviously does not meet the patent writing specification through the DIKW map, and generates a marked application document or an examination notice for reference;

[0040] S3: In the substantive examin...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an intelligent patent application method and system based on DIKW. The method comprises the following steps: S1, in a patent acceptance stage, a patent applicant uploads an application file to a table set by a system, and the system fills the application file into the table through an intelligent filling algorithm; s2, in the preliminary patent review stage, the system judges the application file through a DIKW atlas, identifies or predicts patent content which does not conform to patent writing specifications obviously, and generates the application file with a mark or a review notice which can be used for reference; s3, in the patent application substantive review stage, the system automatically reviews the application file through knowledge representation and semantic recognition technologies according to the patent law, patent implementation detailed rules and patent laws and regulations, and generates the application file with a mark or a review notice for reference; s4, in the patent authorization stage, the system rechecks and records the authorization text through the DIKW atlas. According to the invention, the time loss from patent application to authorization can be reduced.

Description

technical field [0001] The present invention relates to the technical field of patent application, in particular to a DIKW-based intelligent patent application method and system. Background technique [0002] As a product of technological innovation and industrial upgrading, invention patents will inevitably develop with the development of technology. Intellectual property rights centered on invention patents have been impacted by the rapid development of artificial intelligence technology. In this context, industries with innovation as the original driving force need to be continuously upgraded with the development of artificial intelligence to meet people's needs. Traditional patent application, review, reply, authorization and other links need manual review. subjectivity, prone to errors, and the efficiency of manual review is low, which can easily lead to the problem of prolonging the patent application cycle. In view of the above problems, this application proposes a D...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06Q50/18G06F40/174G06F40/30
CPCG06Q50/184G06F40/174G06F40/30
Inventor 段玉聪湛楼高
Owner HAINAN UNIVERSITY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com