Rapid and reliable heat conduction material separating mechanism

Abstract

The invention discloses a rapid and reliable heat conduction material separating mechanism which comprises a base, a label bearing seat, an elastic movable suction nozzle and a suction nozzle seat. The label bearing seat is arranged on the base, the elastic movable suction nozzle is located above the label bearing seat, the suction nozzle seat is used in cooperation with a mechanical arm, and the elastic movable suction nozzle directly faces the upper surface of the label bearing seat to suck a heat conduction material. A pressing mechanism for separating an auxiliary heat conduction material from the adjacent heat conduction material is arranged on the suction nozzle seat. A pneumatic jacking column used for jacking out the heat conduction material upwards is arranged in the label bearing seat, a guide hole used for the pneumatic jacking column to move up and down is formed in the label bearing seat, and an air channel communicating with the guide hole is formed in the position, below the guide hole, of the label bearing seat. The heat conduction materials are separated through the elastic movable suction nozzle and the pneumatic jacking column, the adjacent heat conduction materials are pressed through the pressing mechanism, separation of single materials can be rapidly and reliably achieved, meanwhile, the positions of the adjacent materials are not affected, the suction success rate is greatly increased, and material waste is reduced.

Description

technical field [0001] The invention relates to the technical field of heat dissipation mounting of consumer electronics chips, in particular to a fast and reliable separation mechanism for heat-conducting materials. Background technique [0002] At present, in consumer electronics and other industries, heat-conducting materials need to be mounted due to the large heat generated by chips. This kind of heat-conducting material is usually supplied in a whole piece, and the whole piece of material is distributed in multiple rows and columns. Take a small piece of material and mount it on the corresponding chip, and the material itself has high viscosity, and two adjacent materials will often stick together, which seriously affects the success rate of equipment absorption during placement, resulting in a large amount of material waste and device instability. Contents of the invention [0003] Technical purpose: Aiming at the problem that two adjacent pieces of heat-conducting...

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Problems solved by technology

[0003]Technical purpose: Aiming at the problem that two adjacent pieces of heat-conducting material stick to each other and the separation is inconvenient, the present invention discloses a method that can quickly and reliably realize the separation of a single material at the same time. Fast and reliable separation mechanism for thermally conductive materials that will not affect the position of adjacent materials and reduce material waste

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