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Combined sample and preparation method thereof

A sample and substrate technology, applied in the field of combined samples and its preparation, can solve problems such as misoperation and time-consuming

Active Publication Date: 2021-10-01
YANGTZE MEMORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in the related art, there are many and complicated steps for preparing thinned samples, which is easy to cause misoperation and takes a long time.

Method used

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  • Combined sample and preparation method thereof
  • Combined sample and preparation method thereof
  • Combined sample and preparation method thereof

Examples

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preparation example Construction

[0060] The embodiment of the present application provides a method for preparing a combined sample, figure 2 It is a schematic flow diagram of a method for preparing a combined sample provided in the embodiment of the present application. Such as figure 2 As shown, the method includes the following steps:

[0061] Step 201: Place the sample carrying part on the carrying platform; the sample carrying part includes a vertical base and at least one grid, and the grid is located on the side of the base away from the carrying platform;

[0062] Step 202: forming a groove in the grid; the groove has a first side wall, and the first side wall is perpendicular to the base;

[0063] Step 203: Paste the sample to be thinned on the first side wall of the groove to obtain a combined sample; the pasting surface of the sample to be thinned and the substrate form a first preset angle, and the first preset angle is Let the angle be an acute angle;

[0064] Step 204: Thinning the sample ...

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Abstract

The embodiment of the invention discloses a combined sample and a preparation method thereof, and the preparation method comprises the steps that a sample bearing part is placed on a bearing platform; the sample bearing part comprises a base and at least one grid, and the grid is located at the side, away from the bearing table, of the base; a groove is formed in the grid; the groove is provided with a first side wall, and the first side wall is perpendicular to the substrate; a to-be-thinned sample is pasted on the first side wall of the groove to obtain a combined sample; a first preset angle is formed between the pasting surface of the to-be-thinned sample and the base, and the first preset angle is an acute angle; and the to-be-thinned sample is thinned by utilizing a focused ion beam.

Description

technical field [0001] The present application relates to the field of semiconductor technology, in particular to a composite sample and a preparation method thereof. Background technique [0002] Today, with the continuous development of semiconductor technology, due to the continuous reduction in the size of semiconductor devices, it is becoming more and more difficult to analyze the cause of their failure. Transmission Electron Microscope (TEM, Transmission Electron Microscope) has sub-nanometer high-resolution analysis capabilities , can observe the internal structure and crystal defects of semiconductor devices, and can conduct contrast imaging and electron diffraction research on the same area, and link the shape information with the structure information, so it has become an indispensable tool in the failure analysis of semiconductor devices. important means. [0003] Since TEM uses the electron beam that penetrates the sample for imaging, and the penetration ability...

Claims

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Application Information

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IPC IPC(8): G01N23/20008G01N23/04G01N23/20025G01N23/20058G01N1/28
CPCG01N23/20008G01N23/04G01N23/20025G01N23/20058G01N1/28G01N2223/03G01N2223/0565G01N2223/102
Inventor 董旭林郭伟
Owner YANGTZE MEMORY TECH CO LTD
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