Piezoelectric wafer active sensor packaging structure

Abstract

The invention provides a piezoelectric wafer active sensor packaging structure, and belongs to the technical field of electromechanical impedance. The piezoelectric wafer active sensor packaging structure comprises a flexible circuit board, a piezoelectric wafer active sensor and a radio frequency coaxial adapter; an insulated flexible film is used as a base material, metal layers are formed on the two surfaces of the flexible film in an electroplating or deposition mode, and a printed circuit is manufactured; the piezoelectric wafer active sensor and the radio frequency coaxial adapter are installed on the flexible circuit board, and the three are electrically connected; and the piezoelectric wafer active sensor is packaged, so that the test can be completed without adhering or welding a test signal line on the surface of the piezoelectric wafer active sensor, the direct interconnection of the piezoelectric wafer active sensor and a test instrument is realized, the installation efficiency of the piezoelectric wafer active sensor is accelerated, and due to protection of the flexible film, the durability of the piezoelectric wafer active sensor is improved.

Description

technical field [0001] The invention belongs to the technical field of electromechanical impedance, and relates to a piezoelectric chip active sensor packaging structure. Background technique [0002] At present, electromechanical impedance technology is a relatively good detection method that has high measurement accuracy, does not destroy the integrity of the monitored structure, and does not damage or affect the future performance or use of the monitored structure. The electromechanical impedance technology is a technology that uses the piezoelectric chip active sensor to be glued to the surface of the measured structure with epoxy resin to detect or monitor the measured structure, that is, to use the positive and negative piezoelectric effect and electromechanical coupling characteristics of the piezoelectric chip Obtain mechanical impedance information of the structure under test. During the electromechanical impedance test, the test signal line is drawn out from the e...

AI Technical Summary

Problems solved by technology

[0003] 1) Due to improper operation during the installation process, the piezoelectric chip active sensor may be damaged, resulting in performance defects;

[0004] 2) The pasting operation requires experienced operators to carry out on-site, and the pressure needs to be maintained for a long time to ensure the conductivity, and the waiting time is long;

[0006] 4) The performance of the adhesive layer is greatly affected by environmental factors (temperature, humidity), and it is difficult to ensure the quality of the paste;

[0007] 5) The quality of solder joints is difficult to ensure consistency, and it is difficult to ensure the quality of welding;

[0008] 6) The piezoelectric chip active sensor is exposed to harsh environments during use, which can easily cause damage to the piezoelectric chip active sensor;

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