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Solder joint failure parameter determination method, device, electronic device and storage medium

A technology of failure parameters and determination methods, applied in design optimization/simulation, electrical digital data processing, special data processing applications, etc., can solve problems affecting analysis accuracy, solder joint failure, etc., to improve modeling efficiency and improve technical effects Effect

Active Publication Date: 2022-08-09
CHINA FIRST AUTOMOBILE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such local analysis will lead to unpredictable solder joint failures in the subsequent test analysis process, seriously affecting the accuracy of the analysis

Method used

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  • Solder joint failure parameter determination method, device, electronic device and storage medium
  • Solder joint failure parameter determination method, device, electronic device and storage medium
  • Solder joint failure parameter determination method, device, electronic device and storage medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] figure 1 This is a schematic flowchart of a method for determining the failure parameters of a solder joint provided by the first embodiment of the present invention. This embodiment can be applied to the situation where the failure parameters of the solder joints are determined by modeling, and the method can be determined by the failure parameters of the solder joints. The system can be implemented in the form of software and / or hardware, and the hardware can be an electronic device. Optionally, the electronic device can be a mobile terminal, a PC terminal, and the like.

[0031] like figure 1 Described, the method of this embodiment specifically includes the following steps:

[0032] S110. Acquire a vehicle model, and acquire a solder joint file corresponding to the vehicle model.

[0033] Wherein, the whole vehicle model may be a pre-established vehicle model whose welding point failure parameters are to be determined. The solder joint file may be a file construc...

Embodiment 2

[0053] figure 2 This is a schematic flowchart of a method for determining failure parameters of solder joints provided by the second embodiment of the present invention. On the basis of the above-mentioned embodiments, this embodiment is directed to the conversion method of solder joint types and the parent metal identification of each parent metal to be welded. For the way of determining the attribute information, reference may be made to the technical solution of this embodiment. Wherein, the explanations of terms that are the same as or corresponding to the above embodiments are not repeated here.

[0054] like figure 2 Described, the method of this embodiment specifically includes the following steps:

[0055] S210. Acquire a vehicle model, and acquire a solder joint file corresponding to the vehicle model.

[0056] S220. Determine the type of each solder joint according to the solder joint type object corresponding to each solder joint in the vehicle model, determine...

Embodiment 3

[0078] As an optional implementation of the above-mentioned embodiments, image 3This is a schematic flowchart of a method for determining a solder joint failure parameter provided by the third embodiment of the present invention. Wherein, the explanations of terms that are the same as or corresponding to the above embodiments are not repeated here.

[0079] like image 3 Described, the method of this embodiment specifically includes the following steps:

[0080] The first step is to design and program in the PRIMER software based on the JavaScript programming language.

[0081] The second step is to open the PRIMER software and import the vehicle model.

[0082] Specifically, the vehicle model can be imported and opened through "Model-Read" in the PRIMER software.

[0083] The third step is to select and run the automation script.

[0084] Specifically, in the PRIMER software, the "JavaScript" interface is called up through "Tools-Script", and the automation script is se...

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Abstract

The embodiment of the present invention discloses a method, device, electronic device and storage medium for determining failure parameters of solder joints. The method includes: acquiring a vehicle model, and acquiring a solder joint file corresponding to the vehicle model; The solder joint type object corresponding to each solder joint determines the type of each solder joint, at least one to-be-processed solder joint is determined from the solder joints whose type is a common solder joint, and the corresponding solder joints to be processed are determined according to the vehicle model the second position information; for each solder joint to be processed, according to the first position information and the second position information, determine the part number of each base metal corresponding to the solder joint to be processed, and determine the part number of each base metal according to the part number of the base metal Base metal identification and attribute information of the welding base metal; according to the attribute information of each base metal to be welded, the failure parameters of the welded joints to be processed are determined. Through the technical solutions of the embodiments of the present invention, the failure analysis and modeling of the solder joints at the vehicle level is simplified, and the modeling efficiency is improved.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of solder joint models, and in particular, to a method, device, electronic device, and storage medium for determining failure parameters of solder joints. Background technique [0002] In the analysis of vehicle collision CAE (Computer Aided Engineering, computer aided engineering in engineering design), the failure analysis of solder joints is one of the necessary analysis items. [0003] At present, in the failure analysis of solder joints, the method of modeling is mostly used for analysis and calculation. However, due to the huge number of solder joints in the whole vehicle, many factors such as base metal thickness, yield strength, and solder joint failure formula will be involved in the analysis process, which will lead to problems such as cumbersome modeling methods and long modeling cycles. Therefore, in the process of actual analysis, failure analysis is often not performed on...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/15G06F30/17G06F30/20G06F119/02G06F119/14
CPCG06F30/15G06F30/17G06F30/20G06F2119/02G06F2119/14Y02P90/30
Inventor 黄泽辉朱学武王士彬逯小雨刘乐丹刘国军谢佩玉芦强强
Owner CHINA FIRST AUTOMOBILE
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