Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor process equipment and gas supply assembly thereof

A technology of process equipment and semiconductors, applied in mechanical equipment, gas/liquid distribution and storage, pipeline systems, etc., can solve the problems of flammable and explosive gas leakage, inability to detect leaks in the intake pipeline, etc., and achieve the effect of improving safety

Active Publication Date: 2021-09-24
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005]However, the existing semiconductor process equipment can only detect the leakage of flammable and explosive gas inside the gas cabinet, and cannot detect the leakage of the intake pipeline. The safety risk of flammable and explosive gas leaking into the environment from the air intake pipeline exposed outside the gas cabinet

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor process equipment and gas supply assembly thereof
  • Semiconductor process equipment and gas supply assembly thereof
  • Semiconductor process equipment and gas supply assembly thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0040]In order to solve the above technical problems, as an aspect of the present invention, a gas supply assembly is provided, which is used to provide process gas to multiple gas boxes (Gasboxes) of semiconductor process equipment, the gas box includes a cabinet body and is arranged inside the cabinet body Gaspanel 710, such as figure 2 , image 3 , Figure 14 As shown, the air supply assembly includes an air inlet pipeline 100, the air inlet pipeline 100 has an air inlet end and a plurality of air outlet ends, an air inlet is formed on the cabinet body of the gas cabinet, and the plurality of air outlet ends are used to pass through one by one. The air in...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides semiconductor process equipment and a gas supply assembly thereof. The gas supply assembly is used for providing process gas for a plurality of gas cabinets of the semiconductor process equipment, each gas cabinet comprises a cabinet body and a gas distribution disc arranged in the cabinet body, the gas supply assembly comprises a gas inlet pipeline, the gas inlet pipeline is provided with a gas inlet end and a plurality of gas outlet ends, the plurality of gas outlet ends are used to penetrate through gas inlets of the plurality of cabinet bodies in a one-to-one correspondence mode to be connected with the corresponding gas distribution discs, the gas supply assembly further comprises a sealing pipeline, the gas inlet pipeline is located in the sealing pipeline, the sealing pipeline is provided with a plurality of gas outlet sealing ends, the plurality of gas outlet sealing ends are used for being in sealing connection with the gas inlets of the plurality of cabinet bodies in a one-to-one correspondence mode, and the gas outlet sealing ends are used for being in sealing connection with the gas inlets of the plurality of the cabinet bodies in a one-to-one correspondence mode, and therefore, the sealing pipeline communicates with the interiors of the plurality of cabinet bodies. According to the semiconductor process equipment and the gas supply assembly thereof, the dangerous gas leaked from the gas inlet pipeline is limited by the sealing pipeline and does not leak into the environment, and the dangerous gas in the sealing pipeline can be sucked into a gas holder and then detected, so that the leakage detection of the gas inlet pipeline is realized, and the safety of the semiconductor process equipment is improved.

Description

technical field [0001] The invention relates to the field of semiconductor process equipment, in particular to a semiconductor process equipment and a gas supply assembly thereof. Background technique [0002] In the semiconductor process, the composition of the process gas is often used such as hydrogen (H2), diborane (B 2 h 6 ) and other flammable and explosive gases (the explosive volume fraction of H2 in air is 4%~ [0003] 75%, diborane (B 2 h 6 ) in the air with an explosion volume fraction of 0.8% to 88%, which are extremely flammable and explosive gases), the safety design and leak detection of process gas pipelines are extremely important. [0004] Such as figure 1 Shown is a common semiconductor process equipment structure, including 1 equipment front end module (EquipmentFront End Module, EFEM, usually including manipulator, pre-alignment mechanism, loading port assembly, fan / filter unit and other devices), 1 A transfer mechanism (Transfer Mechanism, TM), 4 ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): F17D1/02F17D5/06
CPCF17D1/02F17D5/06F17D5/005Y02E60/34
Inventor 丁伟
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products