Light-emitting device

Abstract

A light-emitting device including a substrate, an insulating layer, an inner circuit structure, a plurality of light-emitting elements, an insulating encapsulation layer, and a transparent conductive layer is provided. The insulating layer is disposed on the substrate. The inner circuit structure is disposed on the insulating layer. The light-emitting elements are correspondingly disposed on the inner circuit structure. The insulating encapsulation layer is disposed on the inner circuit structure. The insulating encapsulating layer covers a portion of the inner circuit structure and encapsulates the light-emitting elements. The transparent conductive layer is disposed on the insulating encapsulating layer. The transparent conductive layer electrically connects the light-emitting elements, and serially connects the light-emitting elements.

Description

technical field [0001] Embodiments of the present invention relate to a light emitting device. Background technique [0002] With the improvement of manufacturing technology, the light emitting transistor (Light Emitting Diode, LED) has gradually enhanced its luminous efficiency and brightness through continuous research and development, so as to expand and adapt to the needs of various products. However, under the pursuit of reducing the size of the light-emitting transistor and increasing the power and operating current, the light-emitting transistor will relatively generate more heat, which will affect its performance. [0003] In addition, such as submillimeter or micro light-emitting transistors (mini LED or micro LED) are very small in size. Therefore, electrical abnormalities are likely to occur in the die-bonding process and the wire bonding process, thereby increasing the difficulty of the manufacturing process of the light emitting device and reducing the yield of...

AI Technical Summary

Problems solved by technology

Therefore, electrical abnormalities are likely to occur in the die-bonding process and the wire bonding process, thus increasing the difficulty of the manufacturing process of the light-emitting device and reducing the yield of the manufacturing process

In addition, the layout density of light-emitting transistors cannot be further improved because the wire bonding process requires additional wiring space for arranging electrodes.

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