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Ink, screen assembly using same, and electronic equipment

A technology of ink and components, applied in the direction of ink, sub-office equipment, applications, etc., can solve problems that affect the reliability of screen bonding and low bonding strength

Pending Publication Date: 2021-09-03
HONOR DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the ink in the prior art also has the problem of low bonding strength with glue, which affects the bonding reliability of the screen, and needs to be improved

Method used

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  • Ink, screen assembly using same, and electronic equipment
  • Ink, screen assembly using same, and electronic equipment
  • Ink, screen assembly using same, and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0120] 1. Preparation of ink

[0121] In parts by mass, put a mixed solvent of 20 parts of ethyl acetate and 15 parts of butyl acetate into the kettle, add 39.5 parts of epoxy resin, add 15 parts of carbon black (MA100), disperse and stir evenly, and use a sand mill to obtain the mixture Grind three times, control the temperature of the material during the grinding process to not exceed 40°C, then discharge the material, add 10 parts of calcium carbonate, 0.25 parts of silicone defoamer, and 0.25 parts of silicone leveling agent, disperse and stir evenly, grind three times with a sand mill, Afterwards, the material is discharged and filtered to obtain a black ink with high adhesion to PUR.

[0122] 2. Preparation of screen components

[0123] Put the above black ink on a screen printing machine, use a 300-mesh screen to print on the screen cover, and after curing in a temperature-controlled tunnel oven at 160°C for 10 minutes, take it out and form an ink layer on the edge of ...

Embodiment 2-10

[0126] The preparation process of ink and screen assembly in embodiment 2-10 is the same as embodiment 1, and the difference between embodiment 2-10 and embodiment 1 is that the composition of ink is different, each component in the ink of embodiment 1-10 and Its dosage is shown in Table 1 below.

Embodiment 2

[0145] In Example 2, the diluent includes 20 parts of ethyl acetate and 20 parts of butyl acetate, and the filler is 9 parts of calcium carbonate.

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Abstract

The invention relates to the technical field of electronic equipment, and especially relates to an ink, a screen assembly using the same, and electronic equipment. The ink is prepared from, by mass, 35 to 60 parts of epoxy resin, 10 to 15 parts of carbon black, 20 to 40 parts of a diluent, 0.1 to 1 part of a leveling agent, 0.1 to 1 part of a defoaming agent and 0 to 10 parts of a filler. According to the invention, the bonding strength between the ink and the glue can be improved, the bonding reliability of the screen is ensured, and the problem of poor screen connection strength caused by low bonding strength between the ink and the glue in the prior art is relieved.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, in particular to an ink, a screen component using the ink, and an electronic equipment. Background technique [0002] With the continuous development of science and technology, the screen-to-body ratio of mobile phones and other electronic devices continues to increase, and the full screen has become one of the main development trends at present. Moreover, with the advent of the full-screen era of mobile phones and other electronic devices, consumers have higher and higher requirements for screen-to-body ratio, which requires that the proportion of opaque areas such as black border areas on the edges of mobile phone screens is getting smaller and smaller. Helps to increase the screen-to-body ratio. [0003] At present, the mobile phone screen is generally bonded to the middle frame of the mobile phone by an adhesive such as reactive polyurethane hot-melt adhesive, and the ...

Claims

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Application Information

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IPC IPC(8): C09D11/102C09D11/03C09D11/037H04M1/02
CPCC09D11/102C09D11/03C09D11/037H04M1/0266
Inventor 王晓光霍国亮刘子建臧永强
Owner HONOR DEVICE CO LTD
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