Blind buried hole circuit board laser target fool-proof design method

Abstract

The invention discloses a blind buried hole circuit board laser target fool-proof design method, which comprises the following steps that a first laser target is manufactured at each of four corners of the upper surface of an inner-layer sub-board, and three first laser targets are distributed in a right-angle manner, the other first laser target and the first laser targets in the same row or column are arranged in a staggered manner; a second laser target is manufactured at each of four plate edges or four corners of the lower surface of the inner-layer sub-plate, three of the second laser targets are distributed in a right-angle manner, and the other second laser target and the second laser targets located in the same row or column are arranged in a staggered manner; and the first target and the second target do not coincide in the vertical direction. Four laser targets which are not overlapped up and down are respectively manufactured on the two surfaces of the inner layer sub-board so as to play a fool-proof role when laser blind holes are manufactured on the front surface and the back surface of the board, and the two groups of laser targets are respectively provided with a staggered target so as to play a fool-proof role when laser drilling is carried out on the single surface of the board.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a design method for laser target foolproofing of blind buried via circuit boards. Background technique [0002] Blind and buried circuit boards are complex in process design and difficult to manufacture. After statistical analysis, the difficulty of making this type of circuit board is as follows: [0003] 1. Difficulty coefficient of making blind hole plate = difficulty coefficient of blind hole order + difficulty coefficient of blind hole number; [0004] 2. If there are laser drilled blind holes and mechanical drilled blind holes at the same time, the production difficulty factor = laser drilled blind holes + mechanical drilled blind holes; [0005] 3. If the through hole of the resin plug hole needs to be made into a "Via-in-PAD" design, it needs to increase the difficulty coefficient by 15% separately; [0006] 4. If there is electroplating of thi...

AI Technical Summary

Problems solved by technology

[0005]3. For example, the through hole of the resin plug hole needs to be made into "Via-in-PAD" design, and the difficulty factor needs to be increased by 15% separately;

[0006]4. If there is electroplating of thin core boards less than 0.10mm, each core board needs to increase the difficulty factor by 5% separately

[0007]In the existing production method of blind buried hole circuit board, the blind buried holes on the front and back of the board are all superimposed on the same set of targets in the inner layer or in the inner layer respectively There is no fool-proof design for aligning targets, and there is no fool-proof design in the inner layer targets of the same group; in addition, when making multi-level blind hole plates, the same group of targets in the inner layer is used for positioning, resulting in It is difficult to locate and grab and make in the later stage

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