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Circuit board processing mold

A technology for processing molds and circuit boards, which is applied in metal processing and other directions, can solve the problems of circuit board position deviation, removal, chip circuit board scratches, etc., to avoid scratches, avoid manual loading, and improve safety Effect

Inactive Publication Date: 2021-08-17
深圳市豪博讯电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the circuit board processing molds on the market still have defects when they are used. First, most of the mold loading process requires manual loading, which reduces the processing efficiency of the mold and is prone to safety hazards. Secondly, during the stamping process of the circuit board, The position of the circuit board is easy to shift, and finally, the debris generated by the stamping of the circuit board is difficult to remove from the mold in time, so that the debris is easy to cause scratches on the circuit board

Method used

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Embodiment Construction

[0024] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0025] refer to Figure 1-5 , a circuit board processing mold, comprising a first cylinder 5, a support plate 4, an upper mold 3, a lower mold 1 and a guide pillar 27, the lower mold 1 is located below the upper mold 3, the guide pillar 27 runs through the upper mold 3, and supports The plate 4 is fixed on the top of the guide post 27, the first cylinder 5 is installed on the top of the support plate 4, and the piston rod of the first cylinder 5 is connected with the upper die 3, the bottom of the guide post 27 is fixed with the lower die 1, and the upper die 3 The bottom of the stamping cutter he...

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Abstract

The invention discloses a circuit board processing mold, and relates to the technical field of circuit boards. The circuit board processing mold comprises a first cylinder, a support plate, an upper mold, a lower mold and guide pillars, wherein the lower mold is located below the upper mold; the guide pillars penetrate through the upper mold; the support plate is fixed to the tops of the guide pillars; the first cylinder is installed at the top of the support plate; a piston rod of the first cylinder is connected with upper mold; the bottoms of the guide pillars are fixed to the lower mold; stamping tool bits are installed at the bottom of upper mold; and a controller is arranged on one side of top of lower mold. In the circuit board processing mold, vertical plates can move back and forth by controlling the rotation direction of forward and reverse motors in cooperation with the action of bottom plates; and meanwhile, under the action of second cylinders, two top plates move towards or away from each other, so that a circuit board can be clamped and conveyed, the feeding and discharging processes in the circuit board machining process are completed, manual feeding is avoided, and then the safety during feeding and discharging in the circuit board machining process is improved.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, in particular to a circuit board processing mold. Background technique [0002] The circuit board makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and optimizing the layout of electrical appliances. During the processing of the circuit board, it is necessary to use a mold to punch holes. [0003] At present, the circuit board processing molds on the market still have defects when they are used. First, most of the mold loading process requires manual loading, which reduces the processing efficiency of the mold and is prone to safety hazards. Secondly, during the stamping process of the circuit board, The position of the circuit board is easy to shift. Finally, the debris generated by the stamping of the circuit board is difficult to remove from the mold in time, so that the debris is easy to cause scratches on the circuit boa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26F1/02B26D7/02B26D7/06B26D7/18
CPCB26F1/02B26D7/02B26D7/06B26D7/1863B26F2210/08
Inventor 曾邦有曾邦富
Owner 深圳市豪博讯电子科技有限公司
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