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A triode that is easy to package

A technology of triode and shell, applied in transistors, semiconductor/solid-state device parts, semiconductor devices, etc., can solve the problems of high process requirements, poor heat dissipation effect, internal chip influence, etc., to achieve an efficient heat dissipation structure, improve heat dissipation effect, The effect of preventing chip damage

Active Publication Date: 2022-06-17
东莞市柏尔电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The triode is one of the basic components of semiconductors. It has the function of current amplification and is the core component of the electronic circuit. The high temperature generated in the process will affect the internal chip. The existing triode lacks pins that can be used for replacement. After the pin is broken, the entire triode will be scrapped, which will cause great waste. Most of the existing triode Heat dissipation is carried out through the shell, the heat dissipation effect is poor, and the heat generated during operation is accumulated, which is easy to cause damage to the triode

Method used

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  • A triode that is easy to package
  • A triode that is easy to package
  • A triode that is easy to package

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Embodiment Construction

[0017] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0018] see Figure 1-6 , an embodiment provided by the present invention: a triode that is easy to encapsulate, comprising a first casing 1, two inner walls of the first casing 1 are symmetrically fixed with elastic sheets 2, and one outer wall of the elastic sheet 2 is provided with a first card Slot 3, a first connecting block 4 is sleeved on one inner wall of the first shell 1, a first clamping block 5 is symmetrically fixed on the...

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Abstract

The invention discloses a triode that is easy to package, comprising a first shell, a shrapnel, a first slot, a first connection block, a first block, a slot, a first contact, a first pin, a limit ring, The second shell, the receiving groove, the first heat conducting plate, the chip, the first limiting groove, the second pin, the second limiting groove, the cover plate, the first top block, the second top block, the clip block, and the elastic spacer , the second connecting block, the through groove, the second heat conducting plate, the second clamping block, the second clamping slot, the dustproof plate and the limiting block. Compared with the existing triode, the present invention is designed with a casing that is convenient for packaging. The structure is simple in process, easy to assemble and disassemble, no high temperature will be generated during the packaging process, and the performance of the chip will not be affected. The invention is designed with replaceable pins to avoid the scrapping of the triode due to damage to the pins. The design of the invention has The efficient heat dissipation structure can effectively improve the heat dissipation effect of the chip and prevent the chip from being damaged due to high temperature.

Description

technical field [0001] The invention relates to the technical field of triodes, in particular to a triode that is convenient for packaging. Background technique [0002] The triode is one of the basic components of the semiconductor. It has the function of current amplification and is the core component of the electronic circuit. Most of the existing triode and the mounting shell are completely sealed and integrated packaging, which requires high process requirements, inconvenient disassembly and assembly, and the packaging process. The high temperature generated in the process will affect the internal chip. The existing triode lacks pins that can be used for replacement. After the pin is broken, the entire triode will be scrapped, which will cause great waste. Most of the existing triodes The heat dissipation is carried out through the shell, and the heat dissipation effect is poor, and the heat generated during its operation is accumulated, which is easy to cause damage to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/10H01L23/367H01L23/48H01L29/72
CPCH01L23/10H01L23/367H01L23/48H01L29/72
Inventor 夏小明
Owner 东莞市柏尔电子科技有限公司
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