Laser processing equipment of ceramic substrates for circuit boards

Abstract

The invention provides laser processing equipment of ceramic substrates for circuit boards. The two ends of a positioning push rod are arranged to abut against a first forward pushing assembly and a second forward pushing assembly correspondingly so that the positioning push rod can stably push the ceramic substrates to the preset position of a jig plate in one step under pushing of a positioning air cylinder, and redundant steps are omitted. By arranging a vacuum boss, the ceramic substrates can be tightly attached to the jig plate under the action of the air pressure difference, and position deviation caused by vibration to the ceramic substrates is avoided. By arranging a first optical fiber assembly and a second optical fiber assembly to be aligned at the same height, it can be ensured that the feeding height and the discharging height of a feeding and discharging assembly are kept consistent, and then the stability of the feeding and discharging process is ensured. By arranging a height sensor, whether the ceramic substrates placed at the machining station are overlapped or inclined or not can be accurately detected, an alarm is given in time, workers are reminded to clear away obstacles, and normal machining is ensured.

Description

technical field [0001] The invention relates to the technical field of ceramic substrate processing, in particular to laser processing equipment for ceramic substrates used in circuit boards. Background technique [0002] The ceramic substrate refers to the composite substrate formed after the copper foil is directly bonded to the surface of the ceramic substrate at high temperature. The ceramic substrate has the characteristics of good insulation performance, high thermal conductivity, strong current carrying capacity and high adhesion strength, and various patterns can be etched according to actual needs. Therefore, ceramic substrates are widely used in various industries, including communication industry, household appliance industry, computer industry and electronic component industry. [0003] Laser processing refers to the use of the characteristics of the interaction between the laser beam and the material to cut, weld, surface treat or punch the processed material. ...

AI Technical Summary

Problems solved by technology

[0005] Based on this, the embodiment of the present invention provides a laser processing equipment for ceramic substrates for circuit boards, which aims to solve the problem that the laser processing equipment on the market has a low degree of automation, requires more manpower, and reduces the efficiency of laser processing; and, The positioning of laser processing equipment on the market is not accurate, and the position of the ceramic substrate is prone to shift due to vibration during processing, which affects the quality of laser processing.

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