A phase change energy storage radiator

Abstract

The invention relates to and discloses a phase-change energy storage radiator, comprising: a top cover, a packaging base, a cold plate and a phase-change module; the phase-change module includes a metal foam unit and a phase-change material; the top cover, the packaging base and the cold plate are assembled The inner space is used to fill the phase change module; the cold plate is in contact with the heat dissipation surface of the electronic device. The present invention utilizes the strong disturbance caused by the falling of the metal foam unit embedded in the organic phase change material to promote the mixing of cold and hot fluids, thereby enhancing the convection effect in the heat exchange process, and at the same time due to the high thermal conductivity of the metal foam unit, its Adding it to the radiator can significantly increase the thermal conductivity during the heat exchange process, and finally achieve the purpose of synergistically increasing the thermal conductivity and convection, thereby comprehensively improving the heat transfer performance of the phase change energy storage radiator and prolonging the effective protection of electronic devices. time. The invention can improve the reliability of electronic device operation while optimizing the weight and volume of the heat sink.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a phase-change energy storage radiator. Background technique [0002] With the advancement of science and technology, electronic components are developing towards integration, light weight and miniaturization, which makes the heat flux density of electronic equipment increase sharply, and the problem of heat dissipation is becoming more and more prominent. If a large amount of heat cannot be dissipated in a timely manner in a reasonable manner, it will cause the temperature of the electronic device to rise rapidly, thereby affecting the normal use of the electronic device, and even causing the electronic device to fail completely. For special application fields such as missile loading, this will not only cause significant economic losses, but also have a significant impact on combat missions and even national defense security. [0003] At present, the thermal design of ...

AI Technical Summary

Problems solved by technology

Among them, inorganic phase change materials include molten salt, metal, alloy and other phase change materials. Among them, the phase change temperature of molten salt is relatively high, and the mass per unit volume of metal and alloy is relatively large, so they are not suitable for application in the field of heat dissipation of missile-borne electronic equipment.

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