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A method and device for producing a diamond wire saw

A technology of diamond wire saw and corundum, applied in the direction of coating, electrolytic coating, etc., can solve the problems of unguaranteed pass rate, inability to achieve suspension state, difficulty of corundum, etc., so as to avoid bad cutting marks, reduce the quantity of corundum, The effect of reducing input and turnover costs

Active Publication Date: 2022-05-24
CHANGSHA DIAT NEW MATERIAL SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] But no matter how it is improved, there are practical difficulties in making the corundum completely in a uniformly distributed state in the solution
Because the specific gravity of corundum is much greater than that of the solution, it cannot be completely suspended
The situation becomes more difficult when using corundum on the scale of tens of microns
Therefore, in the production process, the pass rate cannot be guaranteed
However, certain materials have high requirements on the surface quality of cutting, which presents great difficulties for diamond wire manufacturers and cutting manufacturers.

Method used

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  • A method and device for producing a diamond wire saw
  • A method and device for producing a diamond wire saw
  • A method and device for producing a diamond wire saw

Examples

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Embodiment 1

[0046] see figure 1

[0047] A method for producing a diamond wire saw, comprising the following steps:

[0048] S1: The conveying mechanism 1 sends the wire body 9 into the dispensing mechanism 2 for dispensing;

[0049] S2: The glue dispensing mechanism 2 dispenses glue on the wire body 9, so that the glue droplets are evenly distributed on the wire body 9, and the conveying mechanism 1 sends the wire body 9 stained with the glue drop into the fixing mechanism 3;

[0050] The step S2 includes the drive circuit of the piezoelectric unit 23 of the glue dispensing mechanism 2 giving electric pulses to the pipeline 21, so that the pipeline 21 is deformed by pressure, the glue in the pipeline 21 is squeezed, and the glue on the first nozzle 22 overcomes the surface tension to form A drop of glue is sprayed onto the surface of the wire body 9 .

[0051] The glue spraying is controlled by the piezoelectric unit 23, the piezoelectric crystal works fast, and the glue spraying spee...

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Abstract

The invention provides a method for producing a diamond wire saw, which includes the following steps: S1: the conveying mechanism sends the wire body into the glue dispensing mechanism for glue dispensing; S2: the glue dispensing mechanism dispenses glue for the wire body to make the glue drop evenly Distributed on the wire body, the conveying mechanism sends the wire body covered with glue drops into the fixing mechanism; S3: The fixing mechanism fixes the emery particles on the wire body, so that a piece of emery is stained on the position with the glue drop, so that the emery is uniform Distributed in the wire body, the conveying mechanism sends the wire body with fixed emery particles into the curing mechanism; S4: the curing mechanism cures the glue droplets on the wire body to strengthen the stability of the emery; S5: the conveying mechanism sends the glue in the curing mechanism The wire body is sent to the electroplating mechanism for electroplating to obtain a diamond wire saw. The invention strengthens the glue spraying speed, and the glue spraying position is fixed, so that the position can be fixed when the diamond is installed, and the diamond particles are distributed on the surface of the wire body in an orderly manner, and the diamond particles are evenly distributed. The gap is consistent to ensure the cutting ability of emery.

Description

technical field [0001] The invention relates to the technical field of diamond wire production, in particular to a method and a device for producing a diamond wire saw. Background technique [0002] Electroplated diamond wire saws have been widely used, the production scale has increased several times, and the application scenarios have continued to increase. It uses metal consolidation to deposit emery on high carbon steel wire for cutting solar, sapphire, ceramic, stone and other materials. [0003] How to evenly distribute the emery on the high carbon steel wire is a key factor that determines the quality of the wire saw. At present, the methods of sand loading include burying sand method, sand blowing method and so on. The former allows the wire to pass through or stand still in the groove where the emery is deposited, and the emery in contact with the steel wire is fixed on the surface of the steel wire by the metal produced by the displacement reaction due to the dis...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D15/00C25D7/06
CPCC25D15/00C25D7/0607
Inventor 丁立乾段志明
Owner CHANGSHA DIAT NEW MATERIAL SCI & TECH
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