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Detection substrate, signal acquisition method thereof and display device

A technology for detection of substrates and signal acquisition, applied in identification devices, instruments, electrical digital data processing, etc., can solve problems such as difficult rapid release or removal of charges, residual images of multi-frame images, and affecting imaging effects, etc.

Pending Publication Date: 2021-07-20
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these captured charges are difficult to be released or cleared quickly, and the slow release or clearing process will inevitably produce afterimages on subsequent multiple frames of images, affecting the imaging effect

Method used

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  • Detection substrate, signal acquisition method thereof and display device
  • Detection substrate, signal acquisition method thereof and display device
  • Detection substrate, signal acquisition method thereof and display device

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Embodiment Construction

[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0048] In the embodiments of the present invention, words such as "first", "second", and "third" are used to distinguish the same or similar items with basically the same functions and functions, only for clearly describing the technology of the embodiments of the present invention scheme, and should not be understood as indicating or implying the relative importance or implying the number of indicated technical features.

[0049] In the embodiments of the pre...

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Abstract

The invention provides a detection substrate, a signal acquisition method thereof and a display device, and relates to the technical field of display, and the detection substrate can well eliminate ghost shadows and is good in imaging effect. The detection substrate is configured to collect signals in at least one signal collection period, and the signal collection period comprises a reset frame period, at least one emptying frame period and a reading frame period according to a time sequence; and the reset frame period comprises at least one positive pressure reset frame sub-period and at least one negative pressure reset frame sub-period, the first positive pressure reset frame sub-period is the positive pressure reset frame sub-period according to the time sequence, and the last negative pressure reset frame sub-period is the negative pressure reset frame sub-period according to the time sequence. The detection substrate comprises: a plurality of pixel units arranged in an array, wherein each pixel unit comprises a control unit and a photoelectric conversion unit; a bias unit; a gate control unit; and a data reading unit. The invention is suitable for signal acquisition of the detection substrate.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a detection substrate, a signal collection method thereof, and a display device. Background technique [0002] TFT (Thin Film Transistor, Thin Film Transistor) photoelectric sensor panel has a relatively simple process, low cost, and is easier to produce on a large scale. It has broad application prospects in identification, medical equipment and other fields. [0003] Currently, TFT photosensor panels usually use a thin film transistor and photodiode structure. The working principle of the TFT photosensor panel is: the photodiode in the negative bias state can convert the light signal into an electrical signal under illumination, and the electrical signal is transmitted to the reading IC (Integrated Circuit, chip) through the thin film transistor connected to it, The reading IC reads the electrical signal and converts it into an image signal to realize photoelectric conversion...

Claims

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Application Information

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IPC IPC(8): G06F3/042G06F3/041G09F9/30
CPCG06F3/042G06F3/0412G09F9/30
Inventor 耿越王奎元李成李重寰代翼丰亚洁祁朝阳李泽飞席聪聪李小贯
Owner BOE TECH GRP CO LTD
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