Tile type active phased array sub-array based on plastic package silicon-based TR chip

Abstract

The invention provides a tile type active phased array sub-array based on a plastic package silicon-based TR chip. The active phased array sub-array comprises an antenna sub-array, a transceiving circuit board and a metal heat dissipation shell; the antenna sub-array is composed of M*N double-layer broadband micro-strip patch radiation units; the transceiving circuit board and all the double-layer broadband micro-strip patch radiating units are stacked, corresponding M*N transceiving channels, control power supply distribution and a power division and synthesis network are integrated into a whole by adopting a multi-layer mixed pressing plate structure, the multiple transceiving channels located at the same partition position are integrated in a plastic package silicon-based TR chip on the transceiving circuit board, and a tile type structure is formed; and a heat conduction metal path is arranged between the plastic package silicon-based TR chip and the metal heat dissipation shell. The system is high in reliability, standardized active phased array sub-arrays which can be freely spliced are formed, and convenience is provided for constructing phased arrays of any scale.

Description

technical field [0001] The invention belongs to the technical field of phased array radar, and relates to a tile-type active phased array sub-array. Background technique [0002] The existing common two-dimensional phased arrays are brick type and tile type. The difference between the two lies in the arrangement direction of TR components and the relationship between the array. Brick-type TR components are perpendicular to the array. Although the spacing of TR components is limited, the vertical dimension can increase the size for device arrangement. The arrangement of tile-type TR components is parallel to the array, that is to say, the maximum area of ​​device arrangement is limited by the spacing of antenna radiation elements, which imposes strict requirements on the size of TR components. Compared with the two, the brick type is less difficult to realize, but the size (especially in the vertical direction) is larger, the volume is large, and the quality is heavy. At pre...

AI Technical Summary

Problems solved by technology

[0003] Traditional brick-type and tile-type TR components are composed of multiple radio frequency chips (such as power amplifiers, low-noise amplifiers, phase shifters, attenuators, microwave switches, etc.) 2D Phased Array Antenna Requirements

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