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Microglass hemisphere resonant gyroscope and wafer-level fabrication method thereof

A technology of micro-glass hemisphere and resonant gyroscope, which is applied in the direction of gyroscope/steering sensing equipment, gyro effect for speed measurement, microstructure technology, etc., can solve the problems of high cost and difficulty of hemispherical resonant gyroscope, reduce volume cost, solve Electrode alignment issues, effects of high symmetry

Active Publication Date: 2017-03-15
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cost of hemispherical resonant gyroscopes processed by traditional machining is as high as US$50,000-100,000 per axis, and limited by the traditional precision processing technology and equipment of fused silica resonators, it becomes very difficult to manufacture hemispherical resonant gyroscopes with a diameter of less than 1cm.

Method used

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  • Microglass hemisphere resonant gyroscope and wafer-level fabrication method thereof
  • Microglass hemisphere resonant gyroscope and wafer-level fabrication method thereof
  • Microglass hemisphere resonant gyroscope and wafer-level fabrication method thereof

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Embodiment 1

[0071] The wafer-level preparation of micro glass hemispherical resonators by thermal foaming process includes the following steps:

[0072] Step one, see Figure 1a , dry etching the silicon wafer to form a silicon mold wafer 1, so that a cylindrical cavity 3 containing a silicon cylinder 4 is formed in the silicon mold wafer 1, and a foaming agent 2 is added to the cylindrical cavity 3; wherein, The thickness of the silicon wafer is not less than 300um; the dry etching is deep reactive ion etching, and the etching depth is less than 100um thicker than the thickness of the highly doped silicon wafer; the foaming agent is a substance that can release gas at high temperature, and TiH can be used 2 , but not limited to TiH 2 ;

[0073] Step two, see Figure 1b A glass wafer 5 is bonded to the upper surface of the silicon mold wafer 1 in step 1 and the upper surface of the silicon cylinder 2 in the cylindrical cavity 3 to form a bonded wafer; wherein the thickness of the glass...

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Abstract

The invention discloses a micro-glass hemispherical resonator gyro and a wafer level preparation method thereof. The micro-glass hemispherical resonator gyro comprises a composite structure substrate; a glass hemispherical resonator; a silicon non-planar electrode embedded in the composite structure substrate; and a packaging glass shell cover; wherein the glass hemispherical resonator consists of a hemispherical shell and a self-aligned column, and the inner surface of the hemispherical shell and the surface of the self-aligned column are coated with a metal conductive layer which is led out by connecting with a silicon leading out channel through another metal layer; the silicon leading out channel and the silicon non-planar electrode are led out on the back of the composite structure substrate by a metal wire. The preparation method includes wafer-level preparing the micro-glass hemispherical resonator by using a thermal foaming process, wafer-level preparing a glass-type silicon non-planar electrode by using a hot reflux process, assembling the glass hemispherical resonator and the glass-type silicon non-planar electrode, and performing vacuum packaging. The hemispherical resonator prepared by the invention has a diameter of 1-10mm, and has high electrode resonator alignment accuracy at the same time.

Description

technical field [0001] The invention relates to a Gothic vibrating gyroscope manufacturing technology in the field of micro-electromechanical systems (MEMS), in particular to a micro glass hemispherical resonant gyroscope and a wafer-level manufacturing method thereof. Background technique [0002] The development of microelectromechanical systems (MEMS) technology has miniaturized many mechanically prepared devices, bringing advantages such as volume reduction, cost reduction, and low power consumption. Since the Draper laboratory reported the first micromechanical silicon-based tuning fork vibrating gyroscope in 1991, the Gothic vibrating gyroscope has benefited from the miniaturization of MEMS technology and has been fully developed. Micromechanical vibrating gyroscopes have developed rapidly and are widely used in consumer products. electronic. At present, the performance of gyroscopes in consumer electronics is basically at the rate level. The performance of micro-mech...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B7/02B81C1/00G01C19/5691
CPCB81B7/02B81C1/00015G01C19/5691
Inventor 尚金堂罗斌
Owner SOUTHEAST UNIV
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