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Glass-packaged ceramic feed-through filter and preparation method thereof

A feed-through filter and glass packaging technology, applied in the field of capacitors, can solve problems such as flux residues, and achieve the effects of avoiding residues, increasing size, and improving cleaning efficiency

Active Publication Date: 2021-06-25
FUJIAN OUZHONG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies in the above-mentioned prior art and provide a kind of effective solution to the flux residue problem and improve the stability of the feed-through filter Glass-encapsulated ceramic feedthrough filter and manufacturing method thereof

Method used

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  • Glass-packaged ceramic feed-through filter and preparation method thereof
  • Glass-packaged ceramic feed-through filter and preparation method thereof
  • Glass-packaged ceramic feed-through filter and preparation method thereof

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Embodiment

[0033] Such as Figure 1-3 Illustrated, a glass-ceramic feedthrough filter package, comprising a needle guide sleeve 100 and the metal housing 100 is provided in the middle of the guide pin 101; bottom 101 of the metal shell 102 is fixed by a glass body and hermetically connected to the guide pin 100 The package of the end portion of the metal casing 101 is formed over the glass body 102, and a receiving chamber 103 is formed inside the metal casing 101, and the glass body 102 is provided with a spacer 104 in the guide pin 100; the gasket 104 The guide pin 100 is provided with a disc multilayer ceramic capacitor 105; the bottom portion of the disc multilayer ceramic capacitor 105 is formed with a first gap 107 at the top of the glass body 102; the disk multilayer ceramic capacitor 105 welding fixation in the receiving chamber 103; between the inner wall of the disc-shaped multilayer ceramic capacitor 105 and the metal housing 101 or outside of the guide pin 100 is formed with at le...

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Abstract

The invention discloses a glass-packaged ceramic feed-through filter and a preparation method thereof. The glass-packaged ceramic feed-through filter comprises a guide pin and a metal shell arranged in the middle of the guide pin in a sleeving mode, wherein the bottom of the metal shell is packaged through a glass body; a gasket sleeved on the guide pin is arranged above the glass body; a disc-shaped multilayer ceramic capacitor is sleeved on the guide pin above the gasket; a first gap is formed between the bottom of the disc-shaped multilayer ceramic capacitor and the top of the glass body; a second gap is formed between the disc-shaped multilayer ceramic capacitor and the inner wall of the metal shell; and the first gap is communicated with the second gap. The filter is advantaged in that the size of the first gap is increased through the gasket, an organic solvent can conveniently enter the first gap for soaking and washing in the later period, the second gap is reserved between the disc-shaped multi-layer ceramic capacitor and the inner side face of the metal shell, the first gap is communicated with the second gap, and therefore the residual position of scaling powder can be conveniently and effectively cleaned; and a residual problem of the soldering flux is effectively avoided.

Description

Technical field [0001] The present invention relates to the field of capacitors, and more particularly to a ceramic feeding filter of a glass package and a preparation method thereof. Background technique [0002] The glass packaged ceramic feeding filter is generally applied to electronic products with high sealing requirements due to superior sealing. The structure product is to sinter with glass of the metal housing, while retaining a certain space without sintering glass in the metal housing, the retained space is used as a subsequent welded multi-layer ceramic capacitor; then the sintered shell Surface electroplating treatment; then put the disc multilayer ceramic capacitor is welded to the housing lead metal solder solder, and the flux is cleaned after welding; the final potting epoxy resin is cured. [0003] The disadvantage of the prior art technical solution is that the flux after the welding of the glass packaged ceramic feeding filter is difficult to clean. Since one e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/207H01P11/00
CPCH01P1/207H01P11/00H01G4/30H01G4/224H01G4/35H01G2/103
Inventor 郑朝勇叶斌
Owner FUJIAN OUZHONG ELECTRONICS CO LTD
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