Preparation method of resistance-type stress-strain composite sensing material

A technology of stress-strain and composite sensing, which is applied in the measurement of the properties and forces of piezoelectric resistance materials, nanotechnology for materials and surface science, and measurement of electric/magnetic solid deformation. Problems such as low utilization rate and high preparation cost can achieve the effect of controllable shape, variable composition and excellent performance

Inactive Publication Date: 2021-06-25
XI AN JIAOTONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the existing flexible sensing materials have problems such as high preparation cost, complicated preparation methods and low recycling rate.

Method used

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  • Preparation method of resistance-type stress-strain composite sensing material
  • Preparation method of resistance-type stress-strain composite sensing material
  • Preparation method of resistance-type stress-strain composite sensing material

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preparation example Construction

[0027] In one embodiment, such as figure 1 As shown, the present disclosure provides a method for preparing a resistive stress-strain composite sensing material, comprising the following steps:

[0028] S100: select a metal substrate as a reaction substrate, and apply a solution containing low reducing metal ions on the reaction substrate at normal temperature and pressure to form a metal micro-nano structure;

[0029] In this step, the reaction substrate is placed in the reaction vessel, and the solution containing low reducing metal ions is drip-coated on the reaction substrate with a dropper. Since the metal ions can undergo in-situ displacement reactions with the metal ions in the reaction substrate, Thus forming a metal micro-nano structure.

[0030] It should be understood that the low reducibility here is a relative concept, that is, the metal ions in the solution have lower reducibility than the metal contained in the metal substrate. Only when this condition is met, ...

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Abstract

The invention discloses a preparation method of a resistance-type stress-strain composite sensing material. The method comprises the following steps of selecting a metal substrate as a reaction substrate, and coating a solution containing low-reducibility metal ions on the reaction substrate at normal temperature and normal pressure to form a metal micro-nano structure; coating the first colloid on the metal micro-nano structure for curing and forming to obtain an unpackaged first material; and peeling off the unpackaged first material from the reaction substrate, and coating the metal micro-nano structure on the opposite side of the first colloid with a second colloid to form a first colloid-metal micro-nano structure-second colloid composite body, and performing curing molding to obtain the packaged resistance-type stress-strain composite sensing material.

Description

technical field [0001] The disclosure belongs to the field of material preparation, and in particular relates to a preparation method of a resistive stress-strain composite sensing material. Background technique [0002] The development of science and technology often relies on the innovation and development of materials, so various functional materials emerge in an endless stream, and flexible sensing materials are also a kind of functional materials developed for specific needs. [0003] In recent years, as the development and research of flexible electronic devices has become a hot spot of social concern, flexible wearable sensor devices have gradually entered people's field of vision, and the development of flexible sensing materials with high sensitivity, fast response and strong stability has become the key . However, a single material cannot meet the demand, so flexible composite sensing materials have become the focus of research. Flexible composite sensing materia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/18G01B7/16B82Y40/00B82Y30/00
CPCG01L1/18G01B7/18B82Y30/00B82Y40/00
Inventor 孔春才杨志懋王安华吕建白星宇白一鸣李成成刘冰洁
Owner XI AN JIAOTONG UNIV
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