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Welding method for microstrip substrate of stepped structure

A welding method and a step-shaped technology are applied in the field of the position step welding method and device of a microstrip substrate, and can solve the problem that multiple position steps cannot be satisfied at the same time.

Pending Publication Date: 2021-06-08
10TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The use of this kind of device for step welding of microstrip substrates can meet the requirements of step welding of microstrip substrates, and solve the welding requirements of traditional fixtures that can only be applied to two-dimensional flat microstrip substrates. Unable to satisfy the usage defect of multiple position ladders at the same time

Method used

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  • Welding method for microstrip substrate of stepped structure
  • Welding method for microstrip substrate of stepped structure

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Embodiment Construction

[0015] refer to Figure 1 ~ Figure 2 . According to the present invention, first, according to the process flow and the size and assembly position of the microstrip substrate, an array of parallel chute 7 is designed on the welding tool template 1, and an adjustable dumbbell-shaped pressure rod 3 is installed in the chute 7, With reference to the actual assembly position of the ladder-shaped microstrip substrate 8 with a position ladder, a manual knob regulator 4 is provided at one end of the screw rod 5 of the dumbbell-shaped pressure rod 3, and for the ladder-shaped microstrip substrate 8 of different sizes, at the end of the screw rod 5 The other end is designed with a screw 5 to control the vertical expansion and contraction of the pressure block 6. When the stepped microstrip substrate 8 with three positions is installed in combination with the welding tool, each screw 5 with the pressure block 6 at one end is welded. The parallel chute 7 on the tooling template 1 passes...

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Abstract

The invention discloses a welding method for a microstrip substrate of a stepped structure, the welding voidage of the microstrip substrate can be reduced, and the microstrip substrate is prevented from warping in the welding process. According to the technical scheme, the welding method comprises the steps that array parallel sliding grooves are designed in a welding tool template, a manual knob adjuster is arranged at one end of each screw of a dumbbell-shaped pressurizing rod and a pressing block controlled to stretch out and retract back in the vertical direction through each screw is designed at the other end of the screw according to the actual assembly position of a stepped microstrip substrate, when combination and installation with a welding tool are carried out, each screw penetrates through a pressing cavity and moves along the corresponding step surface of the step-shaped microstrip substrate, the manual knob adjusters clamp the step-shaped microstrip substrate below the pressing blocks, and each manual knob adjuster presses a step area at each position on the step-shaped microstrip substrate, the step-shaped microstrip substrate is put into vacuum welding equipment, the step-shaped microstrip substrate is welded, and a corresponding welding curve is loaded to complete the welding of the micro-strip substrate.

Description

technical field [0001] The invention belongs to the technical field of microstrip antenna assembly technology, and relates to a method and device for position step welding of microstrip substrates. Background technique [0002] With the development of microstrip antenna manufacturing technology, more and more antenna products contain ladder structures. Microstrip is the basis for realizing effective interconnection between chips and components and providing mechanical support and electrical interconnection. Compared with commonly used microwave antennas, microstrip antennas have many advantages, but their narrow frequency bands severely limit their applications. The microstrip antenna is composed of a radiation patch and a dielectric substrate with a metal floor. The radiation patch can have any geometric shape and size. If the patch adopts a rectangular shape, a rectangular patch antenna is formed. If the patch A circular patch antenna is formed by adopting a circular sha...

Claims

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Application Information

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IPC IPC(8): B23K31/02B23K37/00
CPCB23K31/02B23K37/00
Inventor 海洋
Owner 10TH RES INST OF CETC
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