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Semiconductor cooling device

A cooling device and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of coolant pressure loss, hindering coolant circulation, cooling performance degradation, etc.

Pending Publication Date: 2021-06-04
株式会社力森诺科
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In a liquid-cooled cooler with such a structure, foreign substances mixed in the circulating coolant may clog between the fins and interfere with the circulation of the coolant, causing a decrease in cooling performance.
In addition, in the case of a large amount of foreign matter, the pressure loss of the coolant will also be caused.

Method used

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  • Semiconductor cooling device
  • Semiconductor cooling device
  • Semiconductor cooling device

Examples

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Embodiment Construction

[0047] Figure 1 ~ Figure 6B Three embodiments and modified examples of the liquid-cooled cooler and the semiconductor cooling device of the present invention are shown. In addition, in the following description, it assumes that the same element is represented by the same reference numeral, and description is abbreviate|omitted.

[0048] [The first semiconductor cooling device]

[0049] Figure 1 ~ Figure 2B The illustrated semiconductor cooling device 1 includes an insulating substrate 10 and a liquid-cooled cooler 20 .

[0050]The insulating substrate 10 has a quadrangular shape, and a wiring layer 12 for mounting the semiconductor element 11 is bonded to one surface, and a substrate for relieving stress generated between the insulating substrate 10 and the liquid-cooled cooler 20 and promoting heat transfer is bonded to the other surface. The buffer layer 13. 14 is a solder layer for bonding the semiconductor element 11.

[0051] The liquid-cooled cooler 20 includes a q...

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Abstract

In a semiconductor cooling device provided with a liquid-cooled cooler, a decrease in cooling performance and an increase in pressure loss caused by foreign matter can be suppressed without increasing fin pitch. A semiconductor cooling device (1) is provided with an insulating substrate (10) on which a semiconductor element (11) is mounted, and a liquid-cooled cooler (20). The liquid-cooled cooler (20) is provided with: a heat dissipation substrate (21) on one surface of which a plurality of plate-shaped fins (22) are provided at predetermined intervals; and a case (30) having a recess (31) for accommodating the fin (22), the case (30) being attached to one surface side of the heat dissipation substrate (21) to form a cooling liquid circulation space (35), in which a gap serving as a main flow path (36) is formed between the tip of the fin (22) and the bottom surface of the recess (31) of the case (30), the height H of the main flow path (36) and the dimension W of the fin gap (24) between the fins (22) satisfy H>W.

Description

technical field [0001] The present invention relates to a semiconductor cooling device for cooling a substrate on which a semiconductor element is mounted using a liquid-cooled cooler. Background technique [0002] In recent years, many semiconductor elements handle a large amount of electric power, and the amount of heat generated has increased accordingly. Therefore, a cooler is bonded to the substrate on which the semiconductor element is mounted to dissipate heat. Forced air cooling can be performed in stationary equipment that can secure a large space for heat dissipation, but a liquid-cooled cooler is useful when the equipment is arranged in a limited space. [0003] Conventional liquid-cooled coolers generally have a structure in which thin-plate-shaped inner fins are provided in the coolant flow space and heat is transferred to the coolant through the fins. In a liquid-cooled cooler having such a structure, foreign substances mixed in the circulating coolant may cl...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/473
CPCH01L23/3672H01L23/473
Inventor 松岛诚二
Owner 株式会社力森诺科
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