Packaging chip and server mainboard

Abstract

The invention discloses a packaging chip and a server mainboard. The packaging chip comprises a chip and a packaging substrate with an inner cavity structure, and the chip is packaged in the inner cavity of the packaging substrate. And a connecting line of the chip and a PIN connected a resistor-capacitor piece which needs to be matched with the chip is arranged at the top of the outer side of the packaging substrate, so that the resistor-capacitor piece which needs to be matched with the chip is arranged on the outer top layer of the packaging substrate. According to the invention, the resistor-capacitor arranged on the PCB in the prior art is arranged on the packaging substrate, so that the defects that the PCB wiring difficulty is high and the cost is increased due to excessive devices and uncertain factors such as poor signal quality and abnormal functions are introduced due to additional devices in the prior art can be effectively overcome; and while the integration level and the expansion performance of the PCB are improved, the cost is reasonably controlled, the wiring difficulty of the PCB is reduced, and the testability of the PCB is improved.

Description

technical field [0001] The present application relates to the technical field of printed circuit board design, in particular to a packaged chip and a server mainboard. Background technique [0002] With the rapid development of cloud computing and 5G technology, the data generated by the Internet has also exploded due to the increase of large-capacity content such as audio and video. At the same time, with the popularity of remote homework and online courses, network traffic is in a state of continuous growth. Servers responsible for processing large amounts of data face challenges of high functional complexity and high integration. Therefore, the server needs to integrate more functions in a limited space, and thousands or tens of thousands of networks need to be arranged in an orderly manner on a PCB (Printed Circuit Board, server motherboard). However, with the increase of functions, the PCB routing becomes more complicated. When it is necessary to add extended function...

AI Technical Summary

Problems solved by technology

[0005] This application provides a packaged chip and a server motherboard, which effectively solves the disadvantages of related technologies such as high difficulty in PCB wiring and increased cost due to too many devices, and the introduction of uncertain factors such as poor signal quality and abnormal functions due to additional devices. While improving the integration and expansion performance of the PCB board, reasonably control the cost and reduce the difficulty of PCB board routing, and improve the testability of the PCB

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