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High-strength and high-toughness multilayer composite board and preparation method thereof

A multi-layer composite and composite board technology, applied in the field of composite boards, can solve the problems of limited application of composite boards, poor toughness of PMMA matrix, low elongation at break, etc., to improve impact strength, improve overall toughness, tensile strength Yield stress increase effect

Pending Publication Date: 2021-05-07
JIANGSU JICUI ADVANCED POLYMER MATERIAL RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the PC layer accounts for as high as 80-90% of the thickness. This is due to the poor toughness of the PMMA matrix and low elongation at break. Increasing the PMMA content will lead to a significant decrease in the overall toughness. Only at the cost of sacrificing the rigidity of some materials can the compound be maintained. The balance of sheet hardness and toughness
But even so, the safe tensile deformation of the double-layer composite PC / PMMA sheet generally does not exceed 10%, which will greatly limit the special-shaped application of the composite sheet

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A high-strength and high-toughness multilayer composite board, including polycarbonate layers and polymethyl methacrylate layers, and the polycarbonate layers and polymethyl methacrylate layers are alternately arranged;

[0025] The thickness ratio of the polycarbonate layer to the polymethyl methacrylate layer is 1:1.

[0026] Specifically, the sum of the polycarbonate layer and the polymethyl methacrylate layer is 64 layers, and the number of stacked multiplication units is 5.

[0027] Specifically, the layer thickness of the polycarbonate layer and the polymethyl methacrylate layer is 16 μm.

[0028] A method for preparing a high-strength and high-toughness multilayer composite board comprises the following steps in sequence:

[0029] S1: Pre-crystallization dry blending: Dry the PC raw material at 120°C for 4 hours, then add it to the feeder of the single-screw extruder A of the in-mold multi-layer composite extrusion system, and mix the PMMA raw material at 85°C ...

Embodiment 2

[0036] A high-strength and high-toughness multilayer composite board, including polycarbonate layers and polymethyl methacrylate layers, and the polycarbonate layers and polymethyl methacrylate layers are alternately arranged;

[0037] The thickness ratio of the polycarbonate layer to the polymethyl methacrylate layer is 1:1.

[0038] Specifically, the sum of the polycarbonate layer and the polymethyl methacrylate layer is 128 layers, and the number of stacked multiplication units is 6.

[0039] Specifically, the layer thickness of the polycarbonate layer and the polymethyl methacrylate layer is 8 μm.

[0040] A method for preparing a high-strength and high-toughness multilayer composite board comprises the following steps in sequence:

[0041] S1: Pre-crystallization dry blending: Dry the PC raw material at 120°C for 4 hours, then add it to the feeder of the single-screw extruder A of the in-mold multi-layer composite extrusion system, and mix the PMMA raw material at 85°C ...

Embodiment 3

[0048] A high-strength and high-toughness multilayer composite board, including polycarbonate layers and polymethyl methacrylate layers, and the polycarbonate layers and polymethyl methacrylate layers are alternately arranged;

[0049] The thickness ratio of the polycarbonate layer to the polymethyl methacrylate layer is 1:1.

[0050] Specifically, the sum of the polycarbonate layer and the polymethyl methacrylate layer is 256 layers, and the number of stacked multiplication units is 7.

[0051] Specifically, the layer thickness of the polycarbonate layer and the polymethyl methacrylate layer is 4 μm.

[0052] A method for preparing a high-strength and high-toughness multilayer composite board comprises the following steps in sequence:

[0053] S1: Pre-crystallization dry blending: Dry the PC raw material at 120°C for 4 hours, then add it to the feeder of the single-screw extruder A of the in-mold multi-layer composite extrusion system, and mix the PMMA raw material at 85°C ...

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Abstract

The invention discloses a high-strength and high-toughness multi-layer composite board which comprises polycarbonate layers and polymethyl methacrylate layers, and the polycarbonate layers and the polymethyl methacrylate layers are alternately arranged. The thickness ratio of the polycarbonate layers to the polymethyl methacrylate layers is 1: 1; the preparation method of the high-strength and high-toughness multilayer composite board comprises the following steps: S1, pre-crystallizing, drying and blending; s2, performing in-mold lamination multiplication multi-layer composite extrusion; s3, carrying out three-roller calendaring molding; and S4, cooling, shaping and rolling. The multilayer composite board prepared by the method is high in hardness and rigidity, and the tensile yield stress is also improved.

Description

technical field [0001] The invention belongs to the technical field of composite boards, and in particular relates to a high-strength and high-toughness multilayer composite board and a preparation method thereof. Background technique [0002] With the advent of the 5G era, the mobile phone industry will usher in a new round of changes. The mobile phone backplane market is facing a reshuffle. The trend of de-metallization of mobile phone back covers has accelerated significantly, and non-metallic mobile phone backplanes have gradually become the mainstream configuration in the industry. At the same time, smart home appliances, smart driving systems and other applications that require high electromagnetic wave transmission have also put forward similar product requirements, which can be applied to large-size display devices, multi-touch display panels for car bodies, etc. Modified plastics represented by high-performance engineering resins such as PMMA (polymethyl methacryla...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/08B32B27/36B32B27/30B32B37/15B32B37/10
CPCB32B27/08B32B27/365B32B27/308B32B37/153B32B37/10B32B2307/54B32B2307/558B32B2307/536B32B2307/306B32B2307/20B32B2457/208
Inventor 朱家铭徐杨郭少云沈佳斌
Owner JIANGSU JICUI ADVANCED POLYMER MATERIAL RES INST CO LTD
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