Photovoltaic module and manufacturing method thereof

Abstract

The invention provides a photovoltaic module and a manufacturing method thereof. The photovoltaic module comprises a first battery piece and a solder strip connected with the first battery piece, the first battery piece is provided with a first edge, the back surface of the first battery piece is provided with a laser cutting influence area at a position adjacent to the first edge, and the solder strip is led out from the first edge and is connected to the front surface of the first battery piece. Based on the specific structure and the manufacturing process of the photovoltaic module provided by the invention, the laser cutting influence area of the first battery piece can be effectively prevented from being directly contacted with the solder strip, so that the probability of cracking of the battery piece can be effectively reduced in the lamination forming process of the photovoltaic module, and the single-watt cost of the photovoltaic module is effectively reduced.

Description

technical field [0001] The invention relates to the field of photovoltaics, in particular to a photovoltaic module and a manufacturing method thereof. Background technique [0002] With the increasing pressure of power station investors to connect to the grid at a low price, the industry's demands on the cost of electricity are getting higher and higher. Compared with conventional modules of the same type, the power of half-cut modules has been greatly improved, so half-cut modules have received more and more attention in the industry. During the manufacturing process of the half-cut module, it is necessary to use a laser cutting process to cut the standard-sized battery slice on one surface of the battery slice along the direction perpendicular to the main grid of the battery to form a half-cut battery slice. The battery string of the half-cell module can be formed by connecting the half-cell battery slices in series by laser cutting through the welding ribbon. [0003] H...

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Problems solved by technology

[0003] However, there are the following problems in the current production of half-cell modules: the edge of the half-cell cell formed by laser cutting often constitutes the edge of the ribbon, and the part of the half-cell cell that is adjacent to the edge is directly in contact with the laser during the laser cutting process. , which has a relatively high brittleness; when the ribbon is pulled out from the edge of the half-cell, if the solder ribbon directly contacts the relatively brittle area, it is easier to cause the corresponding cell to break during the subsequent lamination process of the half-cell module. And then affect the power of the half-chip module

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