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Heat dissipation material for mobile phones and processing technology thereof

A heat dissipation material and processing technology technology, applied in the field of material rolling, can solve the problems of insufficient heat dissipation efficiency of heat dissipation materials and inability to meet the development needs of smart phones

Inactive Publication Date: 2021-04-27
深圳市中金岭南鑫越新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a heat dissipation material for mobile phones and its processing technology, aiming to solve the problem in the prior art that the heat dissipation efficiency of the heat dissipation material is insufficient and cannot meet the development needs of smart phones

Method used

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  • Heat dissipation material for mobile phones and processing technology thereof
  • Heat dissipation material for mobile phones and processing technology thereof
  • Heat dissipation material for mobile phones and processing technology thereof

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Embodiment Construction

[0033] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0034] In the drawings of this embodiment, the same or similar symbols correspond to the same or similar components; The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. Construction and operation, so the words describing the positional relationship in the drawings are only for illustrative...

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Abstract

The invention relates to the technical field of material rolling, and discloses a heat dissipation material for mobile phones and a processing technology thereof. The processing technology of the heat dissipation material comprises the following steps of: raw material selection, composite treatment, polishing treatment, first diffusion annealing treatment and calendering treatment. According to the processing technology of the heat dissipation material for mobile phones, a copper strip and a titanium strip are compounded into a whole through certain mechanical occlusion, the heat dissipation material produced through the processing technology integrates the performance characteristics of titanium and copper, good strength and toughness are kept, good heat conductivity is achieved, and therefore, the heat dissipation requirement of mobile phones can be fully met; and meanwhile, the heat dissipation and heat conduction performances of the heat dissipation material are adjusted by adjusting the thickness ratio of the copper strip to the titanium strip, process adjustment is flexible, and only the thickness of metal before compounding needs to be changed.

Description

technical field [0001] The invention relates to the technical field of material rolling, and more specifically, relates to a heat dissipation material for a mobile phone and a processing technology thereof. Background technique [0002] With the intelligent application of mobile phone functions, the quality of life has been greatly improved, and the functional requirements of mobile phones are also constantly pursuing more intelligent applications, which requires mobile phone chips to provide excellent computing power. Of course, high-speed computing and processing will generate heat. The faster the computing speed and the longer the running time, the calorific value will increase accordingly. If the heat is not dissipated in time, the temperature of the mobile phone will gradually rise. It will endanger the safety of the battery and the damage of the chip, so the heat dissipation function of the mobile phone cannot be ignored. [0003] At present, the heat dissipation mate...

Claims

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Application Information

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IPC IPC(8): B32B15/01B32B15/20B32B7/10B32B37/10B32B38/00B21B1/22B21B47/00
CPCB32B15/01B32B15/20B32B7/10B32B37/10B32B38/0036B32B38/0012B21B47/00B21B1/22B32B2038/0048B32B2307/302B32B2307/558
Inventor 覃超郑楠何在专
Owner 深圳市中金岭南鑫越新材料有限公司
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