Circuit board electroplating method
A technology of circuit boards and electroplating equipment, which is applied in the direction of electrical components, printed circuits, and printed circuit manufacturing. It can solve problems such as difficult adjustment of clamp distance, influence on production efficiency, and poor fixation, so as to achieve good clamping effect and improve work efficiency. , the effect of good adjustment ability
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[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.
[0024] see Figure 1 to Figure 9 , an embodiment provided by the present invention:
[0025] A circuit board electroplating method, the circuit board electroplating method is completed based on circuit board electroplating equipment, and then realize the electroplating of circuit boards; the circuit board electroplating equipment includes an upper mounting base 1; the bottom of the upper mounting base 1 is provided with Four pairs of adjusting connecting rods 2; the bottoms of the four pairs of adjusting connecting rods 2 are jointly connected with a group of lower mounting bases 3; the bottom of the lower mounting base 3 is slidingly connected with five sets of slid...
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