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Circuit board electroplating method

A technology of circuit boards and electroplating equipment, which is applied in the direction of electrical components, printed circuits, and printed circuit manufacturing. It can solve problems such as difficult adjustment of clamp distance, influence on production efficiency, and poor fixation, so as to achieve good clamping effect and improve work efficiency. , the effect of good adjustment ability

Active Publication Date: 2021-04-09
徐州里程碑智能科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a kind of circuit board electroplating method, to solve the existing circuit board electroplating method proposed in the above-mentioned background technology needs to fix the circuit board on the electroplating equipment, when the existing electroplating equipment circuit board needs to pass The fixture is fixed, and the position of the existing fixture is generally fixed. When the size of the circuit board is different, the distance between the fixtures is difficult to adjust, resulting in poor fixation. Problems affecting productivity

Method used

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0024] see Figure 1 to Figure 9 , an embodiment provided by the present invention:

[0025] A circuit board electroplating method, the circuit board electroplating method is completed based on circuit board electroplating equipment, and then realize the electroplating of circuit boards; the circuit board electroplating equipment includes an upper mounting base 1; the bottom of the upper mounting base 1 is provided with Four pairs of adjusting connecting rods 2; the bottoms of the four pairs of adjusting connecting rods 2 are jointly connected with a group of lower mounting bases 3; the bottom of the lower mounting base 3 is slidingly connected with five sets of slid...

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Abstract

The invention discloses a circuit board electroplating method which is completed on the basis of circuit board electroplating equipment so as to realize electroplating of a circuit board. The circuit board electroplating equipment comprises an upper mounting base, four pairs of adjusting connecting rods are arranged at the bottom of the upper mounting base; and the bottoms of the four pairs of adjusting connecting rods are jointly connected with a group of lower mounting bases. The method is good in adjusting capacity, higher in adaptability and better in circuit board clamping effect, meanwhile, the synchronous pressing of the five sets of driving clamping blocks can be achieved by rotating a clamping operation piece, the operation is reduced, and the working efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a circuit board electroplating method. Background technique [0002] An important step in the process of circuit board production is electroplating. The principle of electroplating is to electroplate a layer of metal or form an alloy on the surface of other metals. It mainly uses the effect of electrolysis to form the same oxidized metal film on the metal surface or non-metal surface, so as to prevent oxidation, reflect light, and resist corrosion (copper sulfate, etc.). [0003] For example, the application number: CN200910310544.7 The present invention provides an ultra-thin magnetic-fixed printed circuit board electroplating fixture, which is used to clamp the printed circuit board. The printed circuit board electroplating includes a first clamping portion, the first clamping portion includes a main body and a clamping cover, the main body includes a first m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/18
CPCH05K3/187
Inventor 刘明
Owner 徐州里程碑智能科技有限公司
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