A fast positioning ultra-precision wafer grinding equipment

Abstract

The invention belongs to the field of ultra-precision processing, and specifically discloses a fast-positioning ultra-precision wafer grinding device, which includes a fast positioning device and a grinding device. Power unit, vacuum adsorption unit and positioning ring. The vacuum adsorption unit is installed on the rotating power unit and driven to rotate by the rotating power unit. It includes a vacuum suction cup and a vacuum generator connected with the vacuum suction cup. Distributed adsorption holes; the positioning ring is set on the outside of the vacuum chuck and covers part of the adsorption holes, so that the positioning ring can be adsorbed on the vacuum chuck by the action of the vacuum generator, and the inner diameter of the positioning ring is adapted to the outer diameter of the wafer to be positioned ; The grinding device is arranged beside the quick positioning device, and is used for grinding the positioned wafer. The invention can realize the ultra-precision grinding of the wafer, and has the advantages of high positioning precision, high grinding precision, good grinding quality and the like.

Description

technical field [0001] The invention belongs to the field of ultra-precision processing, and more specifically relates to a fast-positioning ultra-precision wafer grinding equipment. Background technique [0002] Wafer is a silicon wafer used in the production of silicon semiconductor integrated circuits. It has a large demand and requires high cutting accuracy. In order to improve the processing speed and accuracy of the wafer during processing, it is necessary to position the wafer quickly and with high precision. Therefore, the wafer The fast and accurate positioning of the wafer is very important to improve the efficiency of wafer processing. After the wafer is positioned, the subsequent grinding process will be carried out. [0003] For wafer positioning, because the wafer is very thin, it is not easy to handle, and it is easy to break after collision. In traditional wafer positioning methods and devices, it often occurs that the positioning time is too long, the posit...

AI Technical Summary

Problems solved by technology

However, none of the above-mentioned existing ultrasonic grinding devices can be applied to the grinding of wafers. The main reasons are as follows: 1) The grinding tool is coaxially arranged with the transmission shaft, and the ultrasonic vibration is along the axial direction of the transmission shaft, which can only realize the Oriented ultrasonic vibration grinding. When the wafer is scribing and edging, the grinding wheel is generally perpendicular to the wafer surface, and radial ultrasonic vibration needs to be applied. The existing axial ultrasonic vibration cannot meet the requirements of wafer grinding. 2) The size of the grinding device is generally large, which cannot meet the high-speed (generally 20000rpm-30000rpm) grinding requirements of the wafer. When performing high-speed grinding, it is difficult for the large-volume grinding device to maintain dynamic balance. Poor grinding quality may even cause adverse consequences such as wafer breakage

In terms of laser-assisted grinding, CN110449995A discloses a laser-assisted grinding device and method for free-form surface grinding, but the grinding needle of the grinding device is usually used for processing free-form surface micro discs and blade parts, and Grinding needles only have a local area interacting with workpieces for processing, so they are not suitable for long-term, high-efficiency, large-volume processing of large-diameter wafers; CN109605138A discloses a built-in laser-assisted ultra-precision cylindrical grinding device and its working method, However, this device can only achieve intermittent laser irradiation, and its laser utilization efficiency is very low, and intermittent laser irradiation will cause inconsistent grinding of the workpiece on the grinding wheel grinding edge with laser areas and without laser areas, resulting in grinding Unevenness greatly affects the grinding quality, so it is difficult to apply to ultra-precision grinding of wafers

[0005] It can be seen that for wafer processing, the existing positioning and grinding devices are not suitable for wafers or have some defects. Therefore, it is necessary to carry out certain research and design in this field to obtain a set that can realize wafer Equipment for fast and precise positioning and ultra-precision grinding of wafers

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