Double-sided cooling structure for power semiconductor module
A power semiconductor, double-sided cooling technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems such as the inability to achieve heat dissipation and cooling of the controller box, the complex structure of the cooler, and improve the cooling effect. effect, close contact, effect of increasing heat capacity
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[0022] Example figure 1 As shown, the double-sided cooling structure for the power semiconductor module of the present invention includes a controller box 1, a power semiconductor module 2, a first radiator 3 and a second radiator 4, and the heat dissipation bottom plate 31 of the first radiator 3 Arranged in parallel with the heat dissipation bottom plate 41 of the second radiator 4, the power semiconductor module 2 is arranged between the heat dissipation bottom plate 31 of the first heat sink 3 and the heat dissipation bottom plate 41 of the second heat sink 4, the first The heat dissipation bottom plate 31 of the radiator 3 is arranged close to the wall of the controller box 1, and the periphery of the heat dissipation bottom plate 31 of the first radiator 3 is connected to the controller box 1, and the heat dissipation bottom plate 31 of the first radiator 3 A first cooling water channel 32 is formed between the wall of the controller box 1, and the input port 33 and the ...
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