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Semiconductor process equipment and bearing device thereof

A technology of carrying device and process equipment, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of low wafer process rate and yield rate, low cooling rate, etc., to improve the overall cooling rate and improve the cooling rate. The effect of cooling speed and increasing production capacity

Active Publication Date: 2021-03-16
北京中硅泰克精密技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the shortcomings of the existing methods, the present application proposes a semiconductor process equipment and its carrying device to solve the technical problems of the prior art that the wafer process rate and yield are low due to the low cooling speed of the carrying device

Method used

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  • Semiconductor process equipment and bearing device thereof

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Embodiment Construction

[0020] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.

[0021] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be ...

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Abstract

The embodiment of the invention provides semiconductor process equipment and a bearing device thereof. The bearing device is arranged in a process chamber of semiconductor process equipment, is used for bearing a to-be-machined workpiece, and comprises a chuck, a cooling disc and a cooling assembly; the chuck is arranged on the cooling disc and used for bearing and fixing the to-be-machined workpiece; a cooling flow channel is formed in the cooling disc and used for introducing a cooling medium to cool the to-be-machined workpiece through the chuck; cooling space is formed in the bottom of thecooling disc; the cooling assembly is arranged in the cooling space and used for introducing cooling gas into the bottom of the cooling disc so as to cool the to-be-machined workpiece through the cooling disc and the chuck. According to the embodiment of the invention, the cooling disc is cooled through the cooling assembly, so that the cooling speed of the to-be-machined part borne on the chuckis greatly increased, the process rate is greatly increased, and the productivity is improved.

Description

technical field [0001] The present application relates to the technical field of semiconductor processing, and in particular, the present application relates to a semiconductor process equipment and a supporting device thereof. Background technique [0002] At present, physical vapor deposition technology to prepare copper is widely used in the field of semiconductor preparation. It can be used as a lead terminal for testing electrical connection and packaging to realize metal interconnection and provide electronic signals and micro-connections for each device in the chip. With the continuous improvement of the manufacturing process, the requirement for the cooling capacity of the carrying device is also getting higher and higher. [0003] In the prior art, when performing plasma etching and physical vapor deposition (Physical Vapor Deposition, PVD) processes, the plasma generated in the process carries high energy, which bombards the wafer to cause heat accumulation, and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67011H01L21/67098
Inventor 不公告发明人
Owner 北京中硅泰克精密技术有限公司
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