Method for optimizing magnetic performance of cobalt-based thin film inductance material by utilizing active metal oxide
A technology of active metals and oxides, applied in the application of magnetic films to substrates, manufacturing of inductors/transformers/magnets, circuits, etc., can solve problems such as limiting the coercive force of CoZrTa thin films, and achieve increased range and controllability Sexuality, convenient control, and strong liveliness
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Embodiment 1
[0033] S1. Clean the surface of the CoZrTa target, the specific cleaning process is as follows:
[0034] (1) Ultrasonic cleaning with acetone alcohol;
[0035] (2) Ultrasonic cleaning with deionized water;
[0036] (3) Finally blow dry by nitrogen.
[0037] S2. Using the magnetron sputtering method, deposit CoZrTa and MgO sequentially on the silicon substrate to form a CoZrTa / MgO structure; first the CoZrTa target is bombarded for 2 minutes and 50 seconds, and then the MgO target is bombarded for 7 minutes and 48 seconds. Bottom vacuum 1×10 -5 Pa, the argon pressure during sputtering is 0.3Pa;
[0038] S3. After the deposition is completed, the sample is subjected to vacuum heat treatment. The process is: the vacuum degree is 1×10 -5 Pa, the heat treatment temperature is 250°C, and the holding time is 30 minutes.
Embodiment 2
[0047] S1. Clean the surface of the CoZrTa target, the specific cleaning process is as follows:
[0048] (1) Ultrasonic cleaning with acetone alcohol;
[0049] (2) Ultrasonic cleaning with deionized water;
[0050] (3) Finally blow dry by nitrogen.
[0051] S2. Using the magnetron sputtering method, sequentially deposit CoZrTa and HfO on the silicon substrate 2 , forming CoZrTa / HfO 2 Structure; first CoZrTa target bombardment for 3 minutes, then HfO 2 The target is bombarded for 3 minutes and 1 second, and the background vacuum of the sputtering chamber is 1×10 -5 Pa, the argon pressure during sputtering is 0.3Pa;
[0052] S3. After the deposition is completed, the sample is subjected to vacuum heat treatment. The process is: the vacuum degree is 1×10 -5 Pa, the heat treatment temperature is 250°C, and the holding time is 30 minutes.
Embodiment 3
[0064] S1. Clean the surface of the CoZrTaB target, the specific cleaning process is as follows:
[0065] (1) Ultrasonic cleaning with acetone alcohol;
[0066] (2) Ultrasonic cleaning with deionized water;
[0067] (3) Finally blow dry by nitrogen.
[0068] S2. Using the magnetron sputtering method, sequentially deposit CoZrTaB and HfO on the silicon substrate 2 , forming CoZrTaB / HfO 2 Structure; first CoZrTaB target bombardment for 3 minutes and 7 seconds, then HfO 2 The target is bombarded for 3 minutes and 1 second, and the background vacuum of the sputtering chamber is 1×10 -5 Pa, the argon pressure during sputtering is 0.3Pa;
[0069] S3. After the deposition is completed, the sample is subjected to vacuum heat treatment. The process is: the vacuum degree is 1×10 -5 Pa, the heat treatment temperature is 250°C, and the holding time is 30 minutes.
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