Packaging and shaping method for bagged FOSB sealed by ultrasonic waves

Abstract

The invention discloses a packaging and shaping method for a bagged FOSB sealed by ultrasonic waves. The method comprises the following specific steps that the FOSB is moved onto a shaping station, abag opening of a packaging bag is clamped, a vacuum air suction pipe is inserted in, and shaping of the back surface and the side surface of the FOSB is conducted while the interior of the packaging bag is subjected to vacuum pumping by the vacuum air suction pipe; After vacuum pumping is completed, the vacuum air pumping pipe is pumped out, and an ultrasonic sealing device conducts sealing operation on the bag opening of the clamped packaging bag; and after the sealing operation is completed, a vacuumizing device and the ultrasonic sealing device are moved to the initial positions, an FOSB front-end shaping device begins to shape the packaging bag on the front face of the FOSB, the FOSB is moved away after shaping is completed, and finally the FOSB front-end shaping device is reset. By adoption of the method, vacuumizing and automatic shaping of the bagged FOSB packaging bag can be automatically achieved, the shaping efficiency is improved, the whole process is fully automatic, and the labor cost is reduced.

Description

technical field [0001] The invention relates to the field of FOSB packaging, in particular to a packaging shaping method for bagged FOSB using ultrasonic sealing. Background technique [0002] Wafer refers to a silicon chip made of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. A wafer is a carrier used in the production of integrated circuits. A wafer in the general sense basically refers to It is a single crystal silicon wafer. The single crystal silicon wafer is refined from ordinary silicon sand. After being dissolved, purified, and distilled, it supports a single crystal silicon rod. After the single crystal silicon rod is polished and sliced, it becomes a wafer. With the continuous development of integrated circuit manufacturing technology, the feature size of the chip is getting smaller and smaller, the number of interconnection layers is increasing, and the diameter of the wafer is also increasing. To achieve multi-lay...

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Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of low efficiency and low degree of automation caused by manual shaping of the existing FOSB bagged packaging bags, and proposes a packaging shaping method for bagging FOSB using ultrasonic sealing, which can be automatically realized Vacuuming and automatic shaping of FOSB bags after bagging improves shaping efficiency

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