Solder ball arrangement unit and packaging chip

Abstract

The invention provides a solder ball arrangement unit and a packaging chip. The solder ball arrangement unit comprises a first signal solder ball pair and a second signal solder ball pair which are vertically arranged, and a plurality of grounding solder balls disposed around the first signal solder ball pair and the second signal solder ball pair, wherein the first signal solder ball pair comprises two first signal solder balls arranged at an interval along a first direction, the second signal solder ball pair comprises two second signal solder balls arranged at an interval along a directionvertical to the first direction, and the projections of the first signal solder balls along the first direction fall into the interval between the two second differential signal solder balls. Throughthe above mode, the crosstalk between the solder ball arrangement units in the packaged chip is small, the signal transmission speed is increased, the solder ball density in the prepared chip is improved, the chip area is small, and the preparation of a microchip is facilitated.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a solder ball arrangement unit and a packaged chip. Background technique [0002] As the connection carrier between the silicon chip and the PCB, the package plays the role of signal transmission and is an important part of the chip. With the development of serial communication technology, the single channel rate has reached 112Gbps; and the system capacity is getting larger and larger, it is inevitable to integrate multiple serial channels in a single chip. Multiple high-speed serial channels are transmitted in the package, and there will be a problem of crosstalk between channels. [0003] At present, the main solder ball arrangement methods in the industry are as follows: figure 1 and figure 2 :in figure 1 and figure 2 TXP is the positive receiving port, TXN is the negative receiving port, RXP is the positive transmitting port, RXN is the negative transmitting port, a...

AI Technical Summary

Problems solved by technology

[0004] The TXP and TXN and RXP and RXN between the serializer channels of the above-mentioned existing technical solutions are arranged in parallel, and the crosstalk is large, but if the distance is opened according to the existing method of increasing the isolated ground solder balls, the chip area will be enlarged

This makes the integrated chip unable to achieve miniaturization. However, if the small-pitch solder ball arrangement is used, the channel physical distance between the receiving port (TX) and the transmitting port (RX) will be shortened, and the crosstalk will deteriorate.

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