Electroplating device

Abstract

The invention discloses an electroplating device. The electroplating device comprises a placement bottom plate, a backflow cavity pipe is fixedly connected to the middle position of the top of the placement bottom plate, a filter element pipe is movably connected to the top of the backflow cavity pipe, and backflow pipes communicate with the bottoms of the front face and the back face of the outersurface of the backflow cavity pipe. A magnetic control mechanism is fixedly connected to the position, located on the outer side of the backflow cavity pipe, of the top of the placement bottom plate, a trigger mechanism is movably connected to the side, away from the backflow cavity pipe, of the magnetic control mechanism and on the top of the placement bottom plate, and an electroplating box ismovably connected to the side, away from the placement bottom plate, of the trigger mechanism. A pressure applying mechanism is arranged at the middle position of the bottom of an inner cavity of theelectroplating box, an inner regulation and control mechanism is movably connected to the position, located on the outer side of the pressure applying mechanism, of the bottom of the inner cavity ofthe electroplating box, and the electroplating device relates to the technical field of electroplating. Internal element particles are filtered through flowing filtration of internal electroplating liquid, so that simultaneous electroplating replacement of the internal element particles of the equipment and a machined part is avoided, normal electroplating is guaranteed, and the machining qualityand efficiency are guaranteed.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating device. Background technique [0002] Electroplating refers to a surface processing method that uses an electrolytic device to reduce the anode metal ions in the salt electroplating solution including the anode metal to simple metal by using the principle of oxidation-reduction reaction, and deposit the simple metal on the surface of the workpiece to be electroplated to form a coating. [0003] According to the Chinese patent CN207468763U, the mobile stirring electroplating device moves the workpiece to be plated vertically and / or horizontally, so that the workpiece moves in a circle relative to the fixed nozzle, so that the coating of the workpiece cannot form uneven coatings, and individual The brightness between electroplating areas is consistent, greatly improving the quality of electroplating, and the structure is simple. During the electroplating p...

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides an electroplating device, which solves the problem that in the electroplating process, due to the replacement of elements in the electroplating solution, the elements are aggregated to form element particles and form impurities, which have a negative effect on the electroplating solution. The problem of partitioning and affecting the processing quality of electroplating

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