Manipulator handover station calibration method and device, equipment and storage medium

Abstract

The invention discloses a manipulator handover station calibration method and device, equipment and a storage medium. The manipulator handover station calibration method comprises the steps that aftercollision occurs, whether the collision points of two nearest previous collisions are located on the inner wall of the same side of a V-shaped groove or not is judged, if yes, a manipulator is controlled to conduct stepping in the stepping direction and the stepping distance of the previous stepping, and the manipulator is controlled to move in the collision direction till a first calibration part collides with the inner wall of the V-shaped groove; and if not, the manipulator is controlled to conduct stepping in a second stepping direction and a second stepping distance, and to move in the collision direction until the first calibration part collides with the inner wall of the V-shaped groove, whether a station calibration index is met or not is judged during each collision, and if not,collision operation is continuously executed until the station calibration index is met. On the premise that the station calibration precision is guaranteed, the collision frequency of the first calibration part and the V-shaped groove is reduced, the calibration time is shortened, and the calibration efficiency is improved.

Description

technical field [0001] The embodiments of the present invention relate to the field of lithography equipment, and in particular to a method, device, equipment and storage medium for calibrating a manipulator handover station. Background technique [0002] Lithography equipment is a device for exposing and imaging mask patterns onto silicon wafers. In lithography equipment, the substrate transfer system is used to quickly, accurately and reliably transfer the substrate to the workpiece table or substrate library. With the continuous development of technology in the integrated circuit manufacturing industry and the continuous improvement of chip marking accuracy, the requirements for the transmission system are reflected in the improvement of the accuracy of silicon wafer transmission to the workpiece table. Calibration accuracy requirements are getting higher and higher. [0003] In the existing silicon wafer transmission subsystem, the following two methods are mainly used ...

AI Technical Summary

Problems solved by technology

This method has a large number of collision points, takes too long, needs to fit two curves, and introduces errors that are magnified

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