Element embedded packaging method and integrated circuit component

Abstract

The invention relates to the technical field of PCB packaging, and discloses an element embedded packaging method and an integrated circuit component, and the method comprises the following steps: forming a through groove in a core plate; covering the lower surface of the core plate with a positioning layer to position a element; filling the upper surface of the through groove with a first fillinglayer, and filling the upper surface of the core plate with a second filling layer; removing the positioning layer on the lower surface of the core plate; filling the lower surface of the through groove with a third filling layer, and filling the lower surface of the core plate with a fourth filling layer; arranging a dielectric layer and a dielectric layer conducting circuit on the outer sides of the second filling layer and the fourth filling layer respectively; drilling; and performing conducting treatment on the inner surface of the drilled hole. The element embedded packaging method andthe integrated circuit component have the advantages that a local reinforcing and filling method is added in the pressing process of a PCB, a gap with a large depth ratio between an element and a groove cavity is supplemented and filled in a targeted manner in a local range, and a reinforcing adhesive layer with a small area increases the filling amount and improves the filling uniformity.

Description

technical field [0001] The invention relates to the technical field of PCB board packaging, in particular to an element embedding method of a printed circuit board and an integrated circuit component. Background technique [0002] With the development trend of electronic products to small size and high performance, PCB printed circuit boards need to carry more and more electronic components, and the surface space of PCB printed boards is limited, so more and more components originally mounted on PCB printed circuit boards The electronic components on the surface of the board are directly packaged into the PCB board by embedding, which can save surface mounting space, reduce product volume, and improve performance. [0003] The prior art has provided relatively mature methods for embedding components in the core board of the PCB. However, due to thinner and lighter electronic products, the method provided by the prior art is also an embedding method for relatively thinner an...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a component embedded packaging method and integrated circuit components to solve the problem of insufficient filling when embedding components in the PCB board, especially the filling when embedding thicker components in the PCB question

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