SMT process prediction tool for intelligently deciding PCB quality

Abstract

The invention discloses an SMT process prediction tool for intelligently deciding PCB quality, and aims to provide a tool set which is high in automation degree, accurate in pushing process parameter,controllable in process and low in defect rate. According to the technical scheme, a data fusion tool automatically reads size parameters and component information on design conditions of a to-be-assembled printed board through a database, design condition lists of different components are formed for a software execution layer, a printing parameter decision-making tool set and a welding parameterdecision-making tool set in the software execution layer perform comparison according to printing and welding data under the design conditions of the components on the to-be-assembled printed board,a multi-objective optimization algorithm and a deep learning algorithm are adopted to automatically make decisions on printing parameters and welding parameters, printing and welding quality are predicted, the decided printing and welding process parameters and the corresponding prediction quality results are sent into a human-computer interaction tool set, and the printing and welding process parameters and the quality prediction values are displayed in a visual mode.

Description

technical field [0001] The invention relates to an SMT process prediction tool that applies intelligent technology (SMT) to realize intelligent decision-making of PCB quality, specifically including automatic process decision-making and quality prediction of two key processes of SMT production line printing and welding. Background technique [0002] SMT (Surface Mounted Technology) surface mount technology (surface mount technology), also known as surface mount or surface mount technology, is currently the most popular technology and process in the electronics assembly industry. It is a kind of non-lead or short-lead surface mount components (SMC / SMD for short, Chinese called chip components) mounted on the surface of the printed circuit board (PCB) or other substrates, through reflow soldering or The circuit assembly and connection technology of soldering assembly by dip soldering and other methods. The advantages of using SMT include 1) Electronic products are reduced in ...

AI Technical Summary

Problems solved by technology

How to take effective and sufficient monitoring without affecting production and increasing production costs is a difficult job to do well

Due to many influencing factors, the process design mainly relies on the experience of the craftsman combined with the process test to determine, and the traditional SPC technology, manual experience, etc. are used to conduct preliminary analysis and post-control of the quality, and the improvement of product quality is very limited.

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