A kind of preparation method of sandwich structure superhydrophilic copper foam with capillary effect

Abstract

The invention discloses a preparation method of super-hydrophilic copper with a sandwich structure with capillary effect, comprising: uniformly mixing copper powder, ammonium chloride and deionized water, and then performing vacuum defoaming to form a viscous mixture W1 for use; Process to form a flat-bottomed groove in the middle to obtain the first board; pour the viscous mixture W1 into the flat-bottomed groove to completely fill it, and then evenly spread a layer of nano-copper solder paste on the copper foil around the flat-bottomed groove; take two The plates are superimposed to form a sandwich structure; the sandwich structure is placed in a protective atmosphere containing hydrogen, heated to 350-360°C for heat preservation, continued to heat up to 900-920°C for heat preservation, continued to heat up to 1000-1020°C for heat preservation, and cooled. This method realizes one-step sintering molding, simple process, short process, low cost, and can obtain sandwich structure superhydrophilic copper with good product quality and structural stability, high yield and excellent capillary effect, and can be widely used as a gas-liquid phase Variable heat transfer and cooling components, water-absorbing materials, etc.

Description

technical field [0001] The invention relates to the technical field of heat and mass transfer, in particular to a preparation method of sandwich-structured superhydrophilic copper with capillary effect. Background technique [0002] In recent years, with the breakthroughs in integrated circuit technology, semiconductor technology and the quality of electronic components, the development of high performance, miniaturization and integration of the electronics industry is directly facing the problem of heat dissipation. Electronic components, components, circuit boards, circuits, etc. cannot work reliably at higher temperatures, and even shorten their working life. Copper is widely used in the field of heat transfer and heat dissipation because of its good thermal conductivity. However, pure copper as a heat sink has long been unable to meet the needs of existing heat dissipation technologies. On this basis, combined with the gas-liquid phase change heat transfer of working m...

AI Technical Summary

Problems solved by technology

At present, the capillary structure in the vapor chamber on the market includes wire mesh fibers, copper powder particles, foamed copper, etc. Generally, stainless steel wire mesh is used as the capillary structure, but its porosity is only about 30%, and the connectivity of the pores is not good. Facilitates the flow of refrigerated liquids

If pure copper or pure copper powder sintering process is used as the capillary structure, it can guarantee more than 50% porosity and has good capillary force, but the hydrophilicity is unstable

Moreover, the current vapor chamber technology is complex and requires a series of processes such as cutting, electroplating, stamping, welding, surface treatment, high-temperature sintering, liquid injection, packaging, and testing, and even welding requires two to three times. The process and technical requirements make it difficult to guarantee the quality of the finished product of the vapor chamber, the stability is poor, the yield is low, and the cost is high

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