A lead frame of a high-power drive circuit and its production method

Abstract

The invention discloses a lead frame of a high-power driving circuit and a production method, comprising a lead frame body, a splicing component is fixed inside one side of the lead frame body, and a heat dissipation component is fixed outside one side of the lead frame body; The splicing assembly includes engaging blocks that are distributed and welded on one side of the lead frame main body, one side of the lead frame main body is provided with engaging grooves corresponding to the engaging blocks, and one side of the lead frame main body is provided with engaging grooves. A moving groove, a connecting plate is installed inside one side of the moving groove, the invention can quickly perform the splicing operation, so that a plurality of lead frame bodies can be fixedly connected, which can also reduce the welding operation and avoid the generation of a lot of harmful gases during the welding process. , can effectively protect the environment, also protect personal health, reduce safety hazards, and can continue to conduct heat and heat dissipation, so that the heat inside the main body of the lead frame is rapidly dissipated, and the heat dissipation efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of lead frame equipment, in particular to a lead frame of a high-power driving circuit and a production method. Background technique [0002] The drive circuit is located between the main circuit and the control circuit, and is used to amplify the signal of the control circuit. The PWM pulse output by the control circuit is amplified enough to drive the power transistor-switching power amplification, and the high-power drive circuit is also one of them, and the high-power drive circuit usually uses a lead frame, and the lead frame is used as an integrated circuit chip. The carrier is a key structural component that forms an electrical circuit by means of bonding materials (gold wire, aluminum wire, copper wire) to realize the electrical connection between the terminal of the internal circuit of the chip and the outer lead, and it acts as a bridge to connect with the external wires. effect. [0003] However...

AI Technical Summary

Problems solved by technology

[0003] However, the metal blocks on the existing lead frames are generally fixed by welding, so that in the process of welding, a lot of harmful gases will be produced, which will not only pollute the weather, but also affect the health of welders, increasing the production process. security risks;

[0004] When the lead frame is used, a lot of heat will be generated. If the temperature is not cooled in time, it will easily affect the chip or electronic module and affect its use.

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