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A kind of low thermal conductivity gold material and preparation method thereof, gold ware

A technology of gold material and low thermal conductivity, which is applied in the field of low thermal conductivity gold material and its preparation, can solve the problem of high thermal conductivity of high-purity gold material, and achieve good low thermal conductivity and good use effect

Active Publication Date: 2022-03-11
GUOJIN GOLD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to provide a low thermal conductivity gold material and its preparation method, gold utensils, to solve the problem of high thermal conductivity of high purity gold materials in the prior art

Method used

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  • A kind of low thermal conductivity gold material and preparation method thereof, gold ware
  • A kind of low thermal conductivity gold material and preparation method thereof, gold ware
  • A kind of low thermal conductivity gold material and preparation method thereof, gold ware

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preparation example Construction

[0030] Preferably, the smelted gold material is obtained during smelting, and the preparation method further includes: mechanically rolling the smelted gold material to obtain a low thermal conductivity gold material. After smelting, mechanical rolling treatment is carried out to promote the grain refinement of the surface layer of the material, forming an extremely fine nanostructure, the interface between grains is greatly increased, the thermal resistance is increased, the thermal conductivity is lower, and the hardness of the material is better. Better strength. In the actual operation process, after the low thermal conductivity gold material is obtained through rolling and compaction, the low thermal conductivity gold material can be made into products of different shapes by using the conventional manufacturing process. Of course, after the smelted gold material is made into a gold product, rolling force can be applied to the surface of the product for rolling. This can ...

Embodiment 1

[0049] Low thermal conductivity gold material formula:

[0050] Au 99.99%

[0051] Ti 10ppm

[0052] V 90ppm

[0053] Wherein, the weight ratio of Ti and V is 1.2:8.8.

[0054] Mix according to the above formula and carry out smelting in the atmospheric environment according to the traditional method. The smelting temperature is 1200-1300°C to obtain the smelted gold material, which is rolled to form a gold plate with a thickness of 1mm; The rotational speed of the rolling head is ω=1900r / min, the lateral moving speed of the rolling head is v=8mm / min, the diameter of the rolling steel ball is 3mm, and the rolling depth is 0.15mm.

[0055] The nanostructure structure is obtained at a depth of about 70μm on the gold surface, and the average grain size is 20nm;

[0056] Thermal conductivity: Compared with Comparative Example 1, the thermal conductivity is reduced by 46%;

[0057] Mechanical properties: Hardness (HV): 105.

Embodiment 2

[0059] Low thermal conductivity gold material formula:

[0060] Au 99.99%

[0061] Cr 10ppm

[0062] V 90ppm

[0063] Wherein, the weight ratio of Cr and simple substance V is 1.5:8.5.

[0064] Mix according to the above formula and smelt in the atmosphere environment according to the traditional method. The smelting temperature is 1200-1300°C to obtain the smelted gold material, which is rolled to form a gold plate with a thickness of 1mm; The rotational speed of the rolling head is ω=1900r / min, the lateral moving speed of the rolling head is v=8mm / min, the diameter of the rolling steel ball is 3mm, and the rolling depth is 0.25mm.

[0065] The nanostructure structure is obtained at a depth of about 100μm on the gold surface, and the average grain size is 25nm;

[0066] Thermal conductivity: Compared with Comparative Example 1, the thermal conductivity is reduced by 43%;

[0067] Mechanical properties: Hardness (HV): 98.

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Abstract

The invention provides a low thermal conductivity gold material, a preparation method thereof, and a gold utensil. The low thermal conductivity gold material includes elemental Au, Q and elemental V, wherein Q includes elemental Ti and / or elemental Cr, and the weight content of elemental Au is ≥ 99.99%. On the one hand, the weight content of elemental Au is more than or equal to 99.99%, and the material gold has a high purity, which meets the high purity requirements of precious metal products. On the other hand, the material also includes elemental Q and elemental V, as smaller doping element components, which promotes better low thermal conductivity of the material. At the same time, the mechanical properties of the material, such as hardness, are better, and the use effect is better.

Description

technical field [0001] The invention relates to the field of precious metal processing, in particular to a low thermal conductivity gold material, a preparation method thereof, and a gold utensil. Background technique [0002] With the improvement of people's living standards, great changes have taken place in consumption concepts, and the market for daily life applications of gold products has gradually expanded and entered a new stage of demand. However, gold has excellent thermal conductivity, which causes tableware and tea sets made of it, such as: bowls, spoons, chopsticks, cups and other daily utensils to hold hot food and hot drinks, conduct heat too quickly, and the outer wall temperature is too high, making it difficult to hold or hold. end grip. [0003] Thermal conductivity is the property of a substance to conduct heat. The thermal conductivity is measured by the thermal conductivity coefficient. The thermal conductivity of pure metals is very good, and the the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C5/02C22C1/02C22F1/14C09K5/14A47G19/02A47G19/22A47G21/04A47G21/06
CPCC22C5/02C22C1/02C22F1/14C09K5/14A47G19/02A47G19/2205A47G21/04A47G21/103
Inventor 廖斐鸣
Owner GUOJIN GOLD CO LTD
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